-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueInner Layer Precision & Yields
In this issue, we examine the critical nature of building precisions into your inner layers and assessing their pass/fail status as early as possible. Whether it’s using automation to cut down on handling issues, identifying defects earlier, or replacing an old line...
Engineering Economics
The real cost to manufacture a PCB encompasses everything that goes into making the product: the materials and other value-added supplies, machine and personnel costs, and most importantly, your quality. A hard look at real costs seems wholly appropriate.
Alternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
TTM’s Grand Opening in Malaysia
November 7, 2024 | Marcy LaRont, I-Connect007Estimated reading time: 2 minutes
When I last spoke with Tom Edman, president and CEO of TTM Technologies (TTM), he provided an update about the company’s new high-tech printed circuit board facility under construction in Syracuse, New York, and how the grand opening of a facility in Malaysia is informing TTM’s overall expansion efforts: a cutting-edge facility spread across 27 acres and providing roughly 1,000 jobs. Now, Tom provides more details about the new automated facility, its regional and global impact, and the importance of having both government and industry support.
Marcy LaRont: Tom, tell me about TTM Malaysia.
Tom Edman: TTM Malaysia is a slightly more than 800,000-square-foot building with a single-level production floor, which allows us to incorporate a high degree of automation. For example, we're combining process steps to accommodate automation using inline equipment when and where we can and between process steps as well. We're also using automated guided vehicles (AGVs) to transport panels. Almost everything inside the facility is automated, including the drills and the drill bit sharpening. That might sound mundane, but it is a very important part of the process in terms of keeping the drill points properly calibrated. We have a large facility just above the production floor where we feed chemistry onto the first floor, and we have a sub-basement for taking the waste which delivers the spent water and chemistry to the adjacent waste treatment center for recycling or treatment.
LaRont: Automation is certainly key, so tell me more about the AGVs.
Edman: They move the panels around from the warehouse to the loaders, between the pieces of equipment for each process step, and finally back to the warehouse. You can see these little robots all over the facility.
We incorporated manufacturing execution system (MES) software to dictate their movements. This software runs the shop floor processes and ties into our Oracle® financial system. As we proceed through the ramp-up, this last step toward automation allows us to minimize scrap because we have eliminated manual handling errors.
We have a very long hallway that runs lengthwise throughout the middle of the facility for evacuation purposes. We put in doors with glass panels so visitors can get a good feeling for the entire process. As you move your way through the different process steps, you see drill, plating, test and inspection, and finally return to where you started.
To read this entire conversation, which appeared in the October 2024 issue of PCB007 Magazine, click here.
Suggested Items
U.S. Department of Commerce Announces $1.4 Billion in Final Awards to Support the Next Generation of U.S. Semiconductor Advanced Packaging
01/17/2025 | U.S. Department of CommerceThe U.S. Department of Commerce has announced that CHIPS National Advanced Packaging Manufacturing Program (NAPMP) has finalized $1.4 billion in award funding to bolster U.S. leadership in advanced packaging and enable new technologies to be validated and transitioned at scale to U.S. manufacturing.
Micron Breaks Ground on New HBM Advanced Packaging Facility in Singapore
01/10/2025 | MicronMicron Technology, Inc. broke ground today on a new High-Bandwidth Memory (HBM) advanced packaging facility adjacent to the company’s current facilities in Singapore.
Biden-Harris Administration Announces Arizona State University Research Park as Planned Site for Third CHIPS for America R&D Flagship Facility
01/08/2025 | U.S. Department of CommerceThe Department of Commerce and Natcast announced the Arizona State University (ASU) Research Park in Tempe, Arizona as the anticipated location for the third flagship CHIPS for America research and development (R&D) facility.
SIA Welcomes Announcement of New CHIPS for America R&D Facility in Arizona for Semiconductor Prototyping and Advanced Packaging
01/07/2025 | SIAThe Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer commending the announcement of a new CHIPS for America research and development (R&D) facility in Arizona for semiconductor prototyping and advanced packaging.
GKN Aerospace Officially Opens $55 Million Repair Facility for Aero-Engine Components in San Diego
01/02/2025 | GKN AerospaceGKN Aerospace has opened a new 150,000 square-foot facility in San Diego, California, strengthening the company’s global repair network and commitment to sustainable, cutting-edge MRO solutions.