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SIA Commends Selections for CHIPS R&D Flagship Facilities
November 4, 2024 | SIAEstimated reading time: 1 minute
The Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer commending the selections for the first two CHIPS for America National Semiconductor Technology Center (NSTC) facilities. The first facility will focus on extreme ultraviolet (EUV) lithography research and will be located within NY CREATES’s Albany NanoTech Complex in New York. The second facility (Sunnyvale, CA) will serve as an administrative headquarters for the NSTC and host the Design Enablement Gateway. Together, these programs will advance semiconductor design, research, workforce development, investment, and collaboration for the U.S. semiconductor industry.
“This week’s announcements mark exciting milestones in the implementation of the critical R&D programs enacted in the bipartisan CHIPS and Science Act. EUV lithography research is an investment in American leadership at the leading edge. And, the Albany facility will democratize access to this extraordinary tool and enable NSTC research to commence in the next year, driving the mission to propel American chip innovation from day one.
“Natcast’s site in Sunnyvale, CA will establish a new hub at the heart of Silicon Valley for the next generation of R&D in chip design, electronic design automation (EDA), chip and system architecture, and hardware security. Moreover, the facility will advance core NSTC programs, including the Workforce Center of Excellence—building our industry’s most essential asset: an innovative and skilled workforce. We congratulate the Department of Commerce and Natcast for initiating these impactful programs and applaud their diligent efforts to continue driving American leadership in chips.”
These resources will be available to NSTC members and researchers. Natcast has opened NSTC membership and urges semiconductor companies, universities, nonprofits and research institutions, national labs, and government agencies to take part in shaping the future of U.S. semiconductor R&D leadership.
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U.S. Department of Commerce Announces $1.4 Billion in Final Awards to Support the Next Generation of U.S. Semiconductor Advanced Packaging
01/17/2025 | U.S. Department of CommerceThe U.S. Department of Commerce has announced that CHIPS National Advanced Packaging Manufacturing Program (NAPMP) has finalized $1.4 billion in award funding to bolster U.S. leadership in advanced packaging and enable new technologies to be validated and transitioned at scale to U.S. manufacturing.
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SIA Releases Policy Recommendations for Trump-Vance Administration and 119th Congress
01/16/2025 | SIAThe Semiconductor Industry Association (SIA) released a policy agenda setting forth the U.S. semiconductor industry’s policy priorities and suggested areas for collaboration with the Trump-Vance administration and the 119th Congress.
U.S. Department of Commerce Announces Preliminary Terms with MACOM to Help Strengthen Supply Chain Resilience for U.S. Defense and Telecommunications Industries
01/16/2025 | U.S. Department of CommerceThe U.S. Department of Commerce signed a non-binding preliminary memorandum of terms (PMT) with MACOM Technology Solutions Inc. (MACOM) to provide up to $70 million in proposed direct funding under the CHIPS and Science Act.
SIA Statement on Biden Administration Action Imposing New Export Controls on AI Chips
01/15/2025 | SIAThe Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer regarding the Biden Administration’s decision to publish an interim final rule titled, “Export Control Framework for Artificial Intelligence Diffusion.”