-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueEngineering Economics
The real cost to manufacture a PCB encompasses everything that goes into making the product: the materials and other value-added supplies, machine and personnel costs, and most importantly, your quality. A hard look at real costs seems wholly appropriate.
Alternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
Technology Roadmaps
In this issue of PCB007 Magazine, we discuss technology roadmaps and what they mean for our businesses, providing context to the all-important question: What is my company’s technology roadmap?
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
DuPont Earns Best Partner Award for Innovation from Samsung Electronics
October 31, 2024 | DuPontEstimated reading time: 1 minute
DuPont announced it has been selected for the 2024 Best Partner Award from Samsung Electronics in the Innovation category. The award recognizes DuPont’s development of polishing pads for advanced semiconductor fabrication and was presented at Samsung’s third annual Material-day (M-day) event.
Organized by Samsung Electronics' Materials Technology Group, M-day gathers semiconductor material suppliers and other supply chain partners to discuss materials and technology trends and celebrate outstanding achievements.
DuPont is an innovation leader in polishing pads, slurries and advanced cleans for chemical mechanical planarization (CMP) and continues to invest in the development of new products and features, including offerings for emerging technical performance needs, process efficiency and sustainability. Products such as CMP pads in the Ikonic™ pad family are enabling effective and consistent polishing of semiconductor wafers at the most advanced technology nodes, supporting semiconductor industry advancement for technologies including artificial intelligence (AI), 5G, and data centers.
“Innovation is a collaborative effort, where insight into process requirements and feedback from customers drives product development and optimization,” said Sanjay Kotha, Global Business Director, CMP Technologies, DuPont Electronics & Industrial. “We are honored to be selected for the Best Partner Award for innovation in CMP pads and truly value our relationship with Samsung Electronics. This recognition represents success for our team both for the technical achievements and for the strong collaboration, reflecting our commitment to be a Partner of Choice to our customers.”
At the 2023 M-day event, DuPont was honored by Samsung Electronics with the Best Partner Award in the Environmental, Social and Governance (ESG) category for contributions in establishing a sustainable supply chain by collaborating to develop more sustainable semiconductor materials.
Suggested Items
PCB Design Software Market Expected to Hit $9.2B by 2031
11/21/2024 | openPRThis report provides an overview of the PCB design software market, detailing key market drivers, challenges, technological advancements, regional dynamics, and future trends. With a projected compound annual growth rate (CAGR) of 13.4% from 2024 to 2031, the market is expected to grow from USD 3.9 billion in 2024 to USD 9.2 billion by 2031.
IPC Issues Clarion Call for EU to Reclaim Leadership in Electronics Manufacturing
11/21/2024 | IPCIPC released a synopsis of its recent white paper, Securing the European Union’s Electronics Ecosystem. This condensed document presents a comprehensive overview of the current challenges in Europe’s electronics manufacturing industry and shares actionable steps to help the EU achieve a stronger, more autonomous ecosystem.
IPC Celebrates National Apprenticeship Week with a Focus on Electronics Manufacturing Excellence
11/19/2024 | IPCIPC, a leading global electronics industry association and source for industry standards, training and advocacy, is proud to announce its participation in National Apprenticeship Week, scheduled for November 17-23, 2024.
IPC Introduces First Standard for In-Mold Electronics
11/18/2024 | IPCIPC announces the release of IPC-8401, Guidelines for In-Mold Electronics. IPC-8401 addresses in-mold electronics (IME) technology, providing industry consensus on guidelines for manufacturing processes, part structures, material selection, and production test methods to integrate printed electronics and components into 3D smart structures.
Disruptive Innovation and Generative AI Inventor, Kevin Surace, to Keynote IPC APEX EXPO 2025
11/15/2024 | IPCEach year, IPC APEX EXPO features industry’s most dynamic, innovative minds to deliver keynote presentations that are both educational and entertaining. IPC APEX EXPO 2025 will feature Kevin Surace, an internationally renowned futurist and generative artificial intelligence (AI) innovator.