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American Made Advocacy: Reshoring—About Trust, Not Just Geography

03/25/2025 | Shane Whiteside -- Column: American Made Advocacy
In today’s chaotic political environment, you might have missed the fact that  Congress allocated nearly $3 billion to rip out and replace key components in America’s telecommunications networks. The funding is to remove equipment from networks nationwide because of cyberattacks on internet routers and cellular networks enabled by a Chinese company that makes more than half of the routers sold in the U.S. We know from prior experience and similar transgressions that we cannot trust that Chinese components aren’t being used for nefarious purposes.

Gold as a Key Component in PCBs and IC Substrates

03/20/2025 | Britta Schafsteller, Sandra Nelle, and Kuldip Johal, MKS' Atotech
Gold has long been a cornerstone in the electronics industry, particularly in the surface finishing of PCBs and IC substrates. It provides essential surface protection while enabling various assembling techniques, such as soldering connections and wire bonding, using aluminum, gold, or copper wires.

Cybord Unveils AI-Powered Real-Time Interception (RTI) Solution to Prevent Defective Electronic Products

03/14/2025 | PRNewswire
Cybord, the leading provider of advanced AI-powered electronic component analytics, announced the launch of its Real-Time Interception (RTI) solution, an advanced visual AI-powered software that prevents defective components from being assembled onto Printed Circuit Board Assemblies (PCBAs) in real time.

Würth Elektronik Now an Infineon ‘Preferred Partner’

03/13/2025 | Wurth Elektronik eiSos
Würth Elektronik, one of the leading manufacturers of electronic and electromechanical components, is broadening its collaboration with semiconductor manufacturers.

ASMPT: New Stationary Camera for SIPLACE Placement Machines

03/13/2025 | ASMPT
Market and technology leader ASMPT is offering a new stationary camera available for its placement machines equipped with SIPLACE placement heads CPP and TWIN. It delivers significantly faster processing speeds as well as more component flexibility – from highly integrated ball grid arrays (BGAs) to large-format odd shape components (OSCs).
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