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Managing Energy Flow with Proper Stackup Design 

02/13/2025 | Andy Shaughnessy, Design007
At Design Con 2025, I had the opportunity to speak with Dan Beeker, technical director at NXP Semiconductor, about his technical session, which focused on optimizing PCB layers to best direct signal and power supply energy between these layers. In this interview, Dan discusses the complexities of board stackup and the significance of understanding dielectric layers for effective signal transmission. Dan is something of a “fields evangelist,” spreading the word about the need for designers to focus on fields, not just circuit theory. Toward the end, Dan summed up much of the design segment: Designing something that didn't make it break is not the same thing as designing it correctly. 

Optical Transceiver Shipments Projected to Grow by 56.5% in 2025

02/05/2025 | TrendForce
While DeepSeek has successfully reduced AI training costs, the broader cost reduction of AI models is expected to expand application scenarios and drive an increase in global data center deployments.

Keysight Signs Virtual Power Purchase Agreement for Renewable Energy Development

01/24/2025 | BUSINESS WIRE
Keysight Technologies, Inc., signed a virtual power purchase agreement (VPPA) with Southern Power, a leading U.S. wholesale energy provider and subsidiary of Southern Company, to acquire renewable energy credits produced by a 39 MW portion of the Phase III expansion at the Millers Branch Solar Facility.

Electric Motor Design Firm ECM Appoints David Hartwell as Chief Sales Officer

01/23/2025 | NewsWire
US electric motor design software firm ECM PCB Stator Tech, has tapped David Hartwell as Chief Sales Officer. In this role, Hartwell will lead business development for ECM's PCB Stator products and services.

Beyond Design: Electro-optical Circuit Boards

01/22/2025 | Barry Olney -- Column: Beyond Design
Predicting the role of PCB designers in 10 years is a challenge. If only I had a crystal ball. However, we know that as technology progresses, the limitations of copper PCBs are increasingly apparent, particularly regarding speed, bandwidth, and signal integrity. Innovations such as optical interconnects and photonic integrated circuits are setting the stage for the next generation of PCBs, delivering higher performance and efficiency. The future of PCB design will probably incorporate these new technologies to address the challenges of traditional copper-based designs.
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