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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Lam Research to Invest $3B+ to Expand Global Labs for AI Era

08/18/2026 | Lam Research
Lam Research Corp. announced that it intends to invest more than $3 billion over the next five years to expand its global research and development (R&D) lab network.

Lockheed Martin, Verizon and Partners Demonstrate Airspace Protection Tech

08/17/2026 | PRNewswire
Lockheed Martin, in collaboration with Verizon, NVIDIA, Keysight Technologies, ODC and Astris AI, recently showcased how commercial off-the-shelf (COTS) technologies can make detecting and tracking unmanned aircraft systems (UAS) more accessible, faster to deploy, and easier to scale for public and critical infrastructure protection.

OSI Systems Receives Orders of $10 Million for Electronic Sub-Assemblies

08/11/2026 | BUSINESS WIRE
OSI Systems, Inc. announced that its Optoelectronics and Manufacturing division has received orders valued at more than $10 million in aggregate from a leading IT provider for critical electronic sub-assemblies to be utilized in remote networking hardware.

DOCOMO, Samsung Electronics Achieves Successful Validation of User-level AI-RAN Technology

08/10/2026 | JCN Newswire
NTT DOCOMO, INC. and Samsung Electronics announced that they have successfully validated AI-based radio access network (AI-RAN) optimization technology at the user level.

Telecom Electronic Manufacturing Services Market Size to Hit $414.70 Billion by 2035

08/10/2026 | Globe Newswire
The global Telecom Electronic Manufacturing Services Market was valued at USD 220.92 Billion in 2025 and is expected to reach USD 414.70 Billion by 2035, growing at a CAGR of 6.50% from 2026 to 2035.
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