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Alternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
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New Information Now Available for Popular Podcast Series on PCB Design
October 24, 2024 | I-Connect007Estimated reading time: 1 minute
Exciting news for listeners of On the Line With... PCB 3.0: A New Design Methodology, the popular podcast series hosted by I-Connect007. A 10-page companion guide featuring insights from Cadence's subject matter experts is now available for download.
The world of PCB design is undergoing a remarkable transformation. While advancements in AI, 3D printing, and innovative materials are reshaping the landscape, the industry also faces the challenge of a retiring generation of veteran designers. In this era of change, the need for smarter, faster, and more cost-effective design methodologies has never been greater.
Discover how Cadence is addressing these evolving demands by visiting our podcast page. There, you'll find insightful content, including episodes like “Why Do We Need to Change,” “How Will AI Play a Role,” and “More Power to the EE,” offering valuable perspectives on the future of PCB design.
At I-Connect007, we're committed to delivering valuable content that supports the global electronics community. From magazines, books, and newsletters to podcasts, market reports, and event coverage, we offer diverse resources to help you thrive in the industry.
As the longest-running digital media company in the electronics supply chain, I-Connect007 continues to provide exclusive, high-quality content.
We hope you enjoy the PCB 3.0: A New Design Methodology podcast series and its companion guide.
Suggested Items
I-Connect007 Editor's Choice: Five Must-Reads for the Week
01/17/2025 | Nolan Johnson, I-Connect007We’re even more committed to being your best source for industry news and tips and tricks of the trade. To that end, I’m sharing my favorite news items of the week. They range from reports on quarterly earnings to Dan Feinberg’s coverage of CES and some harsh reality from marketing expert Dan Beaulieu. If you missed it on Monday, be sure to read it again here. It’s well worth your time.
See You in Vienna: Speaker Spotlight on PEDC
01/16/2025 | I-Connect007 Editorial TeamVienna, Austria, is known for its amazing architecture, art museums, and classical music scene. But from now on, Vienna might also be known for its PCB design conference. IPC and FED have partnered to create a new PCB design conference in there. The Pan-European Electronics Design Conference (PEDC) takes place Jan. 29-30, 2025 at the NH Danube City hotel in Vienna.
RIKEN Adopts Siemens' Emulation And High-Level Synthesis Platforms for Next-Generation AI Device Research
01/16/2025 | SiemensSiemens Digital Industries Software announced today that RIKEN, a national research and development agency in Japan, is enhancing its research on next-generation AI devices with Siemens' comprehensive Veloce™
BAE Systems Awarded $85M Contract to Deliver Network Tactical Common Data Links to the U.S. Navy
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Electronic System Design Industry Posts $5.1 Billion in Revenue in Q3 2024
01/15/2025 | SEMIElectronic System Design (ESD) industry revenue increased 8.8% to $5,114.5 million in the third quarter of 2024 from the $4,702.4 million registered in the third quarter of 2023, the ESD Alliance, a SEMI Technology Community, announced in its latest Electronic Design Market Data (EDMD) report.