Keysight Collaborates with Siemens EDA to Enable the Next Generation of Wireless Design
October 23, 2024 | Keysight TechnologiesEstimated reading time: 1 minute
Keysight Technologies, Inc. and Siemens EDA have teamed up to accelerate the efficiency of wireless and defense system design. The integration between Keysight’s Advanced Design System (ADS) and the Siemens Xpedition Enterprise suite of EDA tools enables engineers to more efficiently co-design digital systems and radio frequency (RF) circuits by performing layout and manufacturing in Xpedition and RF Circuit and electromagnetic simulation in Keysight ADS.
Today’s complex wireless and defense system designs demand unprecedented levels of integration between RF and overall system design. These advanced solutions often combine intricate RF components, high-speed digital circuits, and sophisticated signal processing, all of which must work harmoniously.
The collaboration builds on the prior dynamic inter-tool integration from Keysight and Siemens EDA that enabled system design to have bidirectional integration with RF and microwave engineering tools. This initiative integrates complete hierarchical designs bidirectionally between Keysight ADS and Siemens Xpedition Designer and Layout, eliminating the cumbersome and error-prone task of manually translating libraries between the tools.
Engineers can now seamlessly transition between detailed RF design in ADS and system-level design in Xpedition, maintaining integrity across the entire development process. This is crucial for optimizing performance in areas including 5G/6G communications, advanced radar systems, and electronic warfare applications, where the interplay between RF and digital domains is critical to system performance.
The new product is included in Keysight Advanced Design System 2025 and Siemens Xpedition Enterprise release 2409.
Nilesh Kamdar, EDA Design & Verification lead at Keysight said:“We have a long-established track record collaborating with Siemens to support customers in enabling the next generation of wireless design. The bidirectional integration allows engineers to optimize performance across various applications, including 5G/6G and radar systems.”
AJ Incorvaia, Senior Vice President, Electronic Board Systems, Siemens Digital Industries Software said: “As engineering teams strive to achieve digital transformation, the digital thread between RF and electronic system design becomes more critical. We’re pleased to announce improved integration enabling concurrent design to optimize system performance and improve quality while accelerating design closure.”
Suggested Items
I-Connect007 Editor's Choice: Five Must-Reads for the Week
01/17/2025 | Nolan Johnson, I-Connect007We’re even more committed to being your best source for industry news and tips and tricks of the trade. To that end, I’m sharing my favorite news items of the week. They range from reports on quarterly earnings to Dan Feinberg’s coverage of CES and some harsh reality from marketing expert Dan Beaulieu. If you missed it on Monday, be sure to read it again here. It’s well worth your time.
See You in Vienna: Speaker Spotlight on PEDC
01/16/2025 | I-Connect007 Editorial TeamVienna, Austria, is known for its amazing architecture, art museums, and classical music scene. But from now on, Vienna might also be known for its PCB design conference. IPC and FED have partnered to create a new PCB design conference in there. The Pan-European Electronics Design Conference (PEDC) takes place Jan. 29-30, 2025 at the NH Danube City hotel in Vienna.
RIKEN Adopts Siemens' Emulation And High-Level Synthesis Platforms for Next-Generation AI Device Research
01/16/2025 | SiemensSiemens Digital Industries Software announced today that RIKEN, a national research and development agency in Japan, is enhancing its research on next-generation AI devices with Siemens' comprehensive Veloce™
BAE Systems Awarded $85M Contract to Deliver Network Tactical Common Data Links to the U.S. Navy
01/15/2025 | BAE SystemsIn 2024, the U.S. Navy awarded BAE Systems an $85 million production contract to deliver additional Network Tactical Common Data Link (NTCDL) systems.
Electronic System Design Industry Posts $5.1 Billion in Revenue in Q3 2024
01/15/2025 | SEMIElectronic System Design (ESD) industry revenue increased 8.8% to $5,114.5 million in the third quarter of 2024 from the $4,702.4 million registered in the third quarter of 2023, the ESD Alliance, a SEMI Technology Community, announced in its latest Electronic Design Market Data (EDMD) report.