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NextFlex Launches $5M Funding Opportunity to Strengthen US Electronics Industrial Base

03/20/2025 | PRNewswire
NextFlex, the Department of Defense (DoD) sponsored manufacturing innovation institute focused on maturing hybrid electronics, released Project Call 10.0 (PC 10.0), its latest call for proposals that seek to fund projects that further the development and adoption of hybrid electronics while addressing key challenges in advanced manufacturing.

CELUS Drops BOM on Electronics Design Complexity

03/05/2025 | BUSINESS WIRE
CELUS, developer of the leading AI-assisted electronics design platform used by developers and engineers globally, unveiled a new bill of materials (BOM) experience that better satisfies the needs of electronic engineers by helping them choose the right components for the early stages of their PCB design.

One Designer’s Journey With IPC Apprenticeships

03/03/2025 | Cory Blaylock, IPC
If you’d told Steve Chirpich a year ago that he would be designing printed circuit boards, he might have been surprised. After deciding to make a career change to follow his passion for technology and PCB layout design, Steve took a leap into the high-tech world of electronics manufacturing.

iNEMI Hosts Two Sessions at IPC APEX EXPO, Focus on Roadmap for PCB, Assembly, and Laminates

02/26/2025 | iNEMI
The International Electronics Manufacturing Initiative (INEMI) will have two forward-looking sessions at the upcoming IPC APEX EXPO in Anaheim, California (March 18-20). Both sessions are open to conference attendees with a (free) Event Essentials Pass. The two sessions are outlined below.

Keysight Joins Forces with the EU to Drive Innovation in 6G

02/12/2025 | BUSINESS WIRE
Keysight Technologies, Inc. is enhancing Europe’s 6G research and innovation landscape by participating in two projects that are a part of the 6G Smart Networks and Services Joint Undertaking (SNS-JU), a research and innovation program co-funded by the European Union (EU).
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