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Current IssueAdvancing the Advanced Materials Discussion
Moore’s Law is no more, and the advanced material solutions to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.
Inventing the Future With SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
Sales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
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EMA Webinar: Maximize Your Design Productivity in OrCAD X and Allegro X
September 26, 2024 | EMA Design AutomationEstimated reading time: Less than a minute
Learn how the extensible environment in Cadence OrCAD X and Allegro X is being used to enhance and customize the PCB design flow in a webinar held by EMA on Tuesday, October 1st, 2024 @ 11am ET.
What You Will Learn:
- See how the powerful SKILL framework in PCB Editor can be used to create countless time-saving routines and utilities.
- Explore how you can leverage pre-build utilities designed to drastically improve your productivity
- Learn how you can speed up tedious yet important tasks like documentation and drafting as well as integrate support for newer technologies like stretch flex and AOI technologies
- Explore around 50 FloWare utilities built to help you get more done faster
Join special guest, Rolf Nick from FlowCAD.
Visit the EMA Acadamy webpage to learn more and register for the event.
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Sweeney Ng - CEE PCBSuggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
09/19/2025 | Nolan Johnson, I-Connect007We definitely have advanced packaging on our minds this week at I-Connect007. We just launched our monthly “Advanced Electronic Packaging Digest,” and we’re feeling the excitement. Whenever we find ourselves in the middle of a technological sea change, we’re in for some fun.
On the Line With… Podcast: UHDI and RF Performance
09/17/2025 | I-Connect007I-Connect007 is excited to announce the release of a new episode in its latest On the Line with... podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI).
Advanced Packaging: Preparation is Now
09/15/2025 | Nolan Johnson, I-Connect007In this interview, Matt Kelly, CTO for the Global Electronics Association, and Devan Iyer, chief strategist of advanced packaging, define advanced electronics packaging and the critical nature of getting it right in the electronics manufacturing field. They share details from their white paper, “Advanced Packaging to Board Level Integration—Needs and Challenges,” and provide insight into how next-generation packaging will change the design, fabrication, and assembly of printed circuit boards, including the implications for final system assembly.
ASC Sunstone Circuits to Exhibit at AEMS 2025
09/09/2025 | American Standard CircuitsASC Sunstone Circuits will be exhibiting at AEMS 2025 (Anaheim Electronics and Manufacturing Show) to be held at the Anaheim Convention Center on September 24 and 25, 2025.
What EMS Firms Want From Their Software—and What They Get
09/03/2025 | Thiago Guimaraes, Global Electronics AssociationLast November, the Global Electronics Association [as IPC] surveyed EMS and OEM companies to better understand the software tools driving their operations and uncover trends in adoption, satisfaction, and challenges. The survey assessed software tools across critical functions, including ERP, MES, PLM, QMS, LMS, quoting systems, and CRM. Participants shared insights on tool adoption, satisfaction, and selection priorities.