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Alternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
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Cirexx International Inc. Chooses atg A9 Flying Probe Technology for High-speed Electrical Test
September 19, 2024 | atg Luther & Maelzer GmbHEstimated reading time: Less than a minute
atg Luther & Maelzer GmbH confirms delivery of high-speed bare board testing technology to PCB fabricator, Cirexx International Inc., in Santa Clara, CA.
Consistent with the on-going investment in leading edge technologies at Cirexx International Inc., the A9 8 head, double-sided, high speed, high accuracy flying probe test system represents the newest addition to Cirexx’s test department. The latest atg technology enables Cirexx to test the most advanced ultra-fine designs while helping to reach industry leading throughput goals.
atg’s A9 can test pad sizes down to 35 micron and is capable of testing products up to a size of 21” x 24”. The A9 eliminates limitations due to test point density or fine-pitch contacts and features embedded component test, 4-wire Kelvin measurement capability with an accuracy of +/- 0,025 mΩ, HPOT and latent testing, all in combination with a test speed of up to 230 measurements/second.
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Upcoming SMTA UHDI Symposium: Shortening the Learning Curve
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Advantest Forms Strategic Partnerships with FormFactor and Technoprobe
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Revolutionizing PCB Testing: RoBAT's Journey from S1 to SCARA
01/07/2025 | Marcy LaRont, PCB007 MagazineFrom the early days of simple continuity testers to the advanced SCARA machines, RoBAT's evolution in time-domain reflectometer (TDR) and test technology is a testament to the company's commitment to excellence and adaptation in a rapidly changing industry. In this discussion, RoBAT’s Bruce Nockton discusses the journey, challenges, and importance of automating testing solutions, and highlights how RoBAT has become a frontrunner in delivering high-precision testing equipment, setting new standards for the industry.
Biden-Harris Administration Awards SRC $285M for New CHIPS Manufacturing USA Institute for Digital Twins
01/07/2025 | U.S. Department of CommerceThe U.S. Department of Commerce announced that CHIPS for America awarded the Semiconductor Research Corporation Manufacturing Consortium Corporation (SRC) $285 million to establish and operate a CHIPS Manufacturing USA institute headquartered in Durham, North Carolina.