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iNEMI Packaging Tech Topic Webinar: Packaging Interconnect Material Technology Series
September 19, 2024 | iNEMIEstimated reading time: 1 minute
The International Electronics Manufacturing Initiative (iNEMI) continues its Packaging Interconnect Material Technology Series with a webinar on Transient Liquid Phase (TLP) Bonding for High-Temperature Soldering Processes. This session, scheduled for Tuesday, September 24, 2024, will feature guest speaker Dr. Kazuhiro Nogita from the Nihon Superior Centre for the Manufacture of Electronic Materials.
With the increasing demand for high-power devices and applications requiring high-temperature interconnections, this webinar provides an essential overview of how TLP bonding can be utilized to enhance the reliability of SnCu solder systems. The discussion will focus on advances in lead-free Sn-based alloy systems, particularly tin-copper (SnCu), widely recognized for its cost-effectiveness, good fluidity, and low defect rates.
Dr. Nogita will draw from his extensive research to explain how TLP bonding can address the challenges posed by high-power density and miniaturization in electronics. This process makes it possible to achieve strong and reliable connections in demanding high-temperature environments.
About the Speaker
Dr. Kazuhiro Nogita is the founding director of the Nihon Superior Centre for the Manufacture of Electronic Materials (NS CMEM). He is also project manager of the University of Queensland – Kyushu University Oceania project (UQ-KU project) and Deputy Chair of the International Development and Engagement Committee at the School of Mechanical and Mining Engineering. His research is in three major areas: lead-free solders and interconnect materials, energy materials such as hydrogen-storage alloys, and structural and coating alloy development.
Registration:
This webinar is open to industry; advance registration is required, visit iNEMI's website.
Tuesday, September 24, 2024
10:00-11:00 a.m. JST (Japan)
9:00-10:00 p.m. EDT (Americas) on Monday, September 23
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