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The real cost to manufacture a PCB encompasses everything that goes into making the product: the materials and other value-added supplies, machine and personnel costs, and most importantly, your quality. A hard look at real costs seems wholly appropriate.
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Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
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MEMS & Imaging Sensors Summit to Highlight Innovations Driving the Next Generation of Connectivity
September 11, 2024 | SEMIEstimated reading time: Less than a minute
The SEMI MEMS & Imaging Sensors Summit, themed Sensor Revolution for a Connected Future, is set to bring together some of the world’s leading minds in sensor technology on November 14 at the International Conference Center Munich (ICM), Germany. Registration is open.
Hosted by SEMI Europe and the MEMS & Sensors Industry Group, a SEMI Technology Community, the summit will showcase leading-edge innovations in wearable health monitoring, 300mm MEMS manufacturing for increased scalability, and energy-efficient AI for visual applications. Presentations will also explore advancements in hyperspectral imaging, light detection and ranging (LiDAR) for autonomous vehicles, and sustainable sensor technologies driving progress in healthcare, smart mobility, and sustainability.
"As the MEMS and imaging sensors landscape continues to evolve, we’re witnessing rapid advancements in technologies like AI and machine learning, opening doors to innovative applications that are transforming industries,” said Laith Altimime, president of SEMI Europe. “We are excited to bring together industry leaders at this year’s summit to explore how these cutting-edge technologies are coming together to enable sustainable growth and shape a connected future.”
Suggested Items
Hon Hai Research Institute, Yangming Jiaotong University Jointly Won the Future Technology Award
11/26/2024 | Hon Hai Technology GroupHon Hai Research Institute (HHRI), a subsidiary of Hon Hai Technology Group, the world’s largest technology manufacturing and service provider, joins hands with National Yang -Ming Chiao Tung University ( NYCU ) to break through space Computing Extreme stood out at the " 2024 Taiwan Innovation Technology Expo" and won the "Future Technology Award" for its innovative technology of "application of all-gallium arsenide super interface holography in structured light and stereoscopic vision".
Biden-Harris Administration Announces CHIPS Incentives Awards with BAE Systems, Rocket Lab
11/25/2024 | U.S. Department of CommerceThe Biden-Harris Administration announced that the U.S. Department of Commerce has finalized two separate awards under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities. The Department awarded BAE Systems Electronic Systems, a business unit of BAE Systems, Inc., up to $35.5 million in direct funding, and awarded Rocket Lab, the parent company of space power provider SolAero Technologies Corp., up to $23.9 million in direct funding. The Department will disburse the funds based on the companies’ completion of project milestones.
Indium Technical Expert to Present at SiP Conference China
11/25/2024 | Indium CorporationIndium Corporation Senior Area Technical Manager for East China Leo Hu is scheduled to deliver a presentation on Low-Temperature Solder Material in Semiconductor Packaging Applications at SiP China Conference 2024 on November 27 in Suzhou, China.
American Made Advocacy: The Administration Changed, but Our Industry’s Needs Remain
11/26/2024 | Shane Whiteside -- Column: American Made AdvocacyThe beginning of the holiday season in Washington, D.C., this year also signals the changes that come with a new administration. Here are my projections about the effect on our industry. There will be a lot of noise in Washington when a new president occupies the White House and new members of Congress arrive on the scene. It is every member’s job to remind them all that “chips don’t float” and that there is more work to be done to create a secure and resilient supply chain for the microelectronics we depend on.
Western Digital CEO David Goeckeler Elected Chair of Semiconductor Industry Association
11/22/2024 | SIAThe Semiconductor Industry Association (SIA) today announced Western Digital CEO David Goeckeler has been elected Chair of the SIA Board of Directors. SIA represents 99% of the U.S. semiconductor industry by revenue and nearly two-thirds of non-U.S. chip firms.