Flexible Thinking: Mind-tapping into January
Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4
Connect the Dots: Five Best Practices for Designing Flex and Rigid-flex PCBs
AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at NEPCON Vietnam
August 20, 2024 | AIMEstimated reading time: Less than a minute
AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming NEPCON Vietnam taking place September 11-13 at I.C.E. Hanoi, Vietnam. Among other great products, AIM will be highlighting its recently released NC259FPA Ultrafine No Clean Solder Paste.
NC259FPA is a zero-halogen paste engineered for precise print definition with type 6 and smaller alloy powders through stencil apertures less than 150 µm in diameter. Ideal for miniLED, microLED, die attach, micro BGA, and HDI boards, this innovative new product features excellent wetting, high transfer efficiency, high reliability, and high tack force for mass transfer.
To learn more about NC259FPA and to discover all of AIM’s products and services, visit the company at NEPCON Vietnam September 11-13th at booth U05.
Share on:
Suggested Items
AIM to Highlight REL61™, W20, and Ultrafine Paste Offerings at Productronica China
02/19/2025 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming Productronica China, taking place March 26-28 at the Shanghai New International Expo Center.
EIPC 2025 Winter Conference, Day 1: From Manufacturing to Sustainability
02/19/2025 | Pete Starkey, I-Connect007The EIPC 2025 Winter Conference, Feb. 4-5, in Luxembourg City, featured keynotes and two days conference proceedings. This is my report of the first day’s conference proceedings. The keynote session and second-day conference proceedings are reported separately.
SolderKing Doubles Facility to Meet Growing Demand
02/18/2025 | SolderKingSolderKing, a leading UK manufacturer of soldering materials, has expanded its operations by doubling its facility. The move follows a significant rise in export sales throughout 2024 and reinforces the company’s position as a key supplier of regulatory-compliant soldering solutions across the UK and Europe.
Electra Polymers Ltd Becomes Primary Inkjet Soldermask Supplier for TLT PCB, an Affiliated Teltonika Company
02/18/2025 | Electra Polymers LtdElectra Polymers Ltd, a global leader in inkjet materials for the PCB industry, is proud to announce a new partnership with high-tech design and manufacturing company TLT PCB, an affiliated company of Teltonika, becoming the primary supplier of inkjet soldermask for TLT PCB’s new manufacturing facility in Vilnius, Lithuania.
SEHO to Highlight Cutting-Edge Soldering Technology at IPC APEX Expo 2025
02/17/2025 | SEHOSEHO, a worldwide leading manufacturer of complete solutions for soldering processes and automated production lines, is thrilled to present its best-selling selective soldering system SEHO SelectLine-C at the IPC APEX Expo 2025 in Anaheim.