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Current IssueVoices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
The Essential Guide to Surface Finishes
We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
It's Show Time!
In this month’s issue of PCB007 Magazine we reimagine the possibilities featuring stories all about IPC APEX EXPO 2025—covering what to look forward to, and what you don’t want to miss.
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Real Time with… THECA 2024: Workforce Development Critical to Southeast Asia PCB Industry
August 5, 2024 | Real Time with... THECAEstimated reading time: Less than a minute
In this interview, IPC Asia President Sydney Xiao emphasizes the importance of workforce training and keeping ahead of the staffing needs in Thailand and the rest of Southeast Asia. Ms. Xiao shares details on how IPC is addressing these needs. Watch the interview now.
For our full coverage of THECA 2024, visit the Real Time with... THECA 2024 site.
Suggested Items
IPC Rising Star Award: Young-Ho Hwang, Guru E&E
04/23/2025 | Nolan Johnson, I-Connect007Since 2022, IPC has made significant progress for its Korean members. Young-Ho Hwang has been instrumental in driving these developments. As a core advisory committee member and chair of the 610 RTG, he has played a key role in guiding IPC Korea’s strategic direction, championed the development and adoption of IPC standards across industries, and fostered strong collaborations with stakeholders.
Real Time with... IPC APEX EXPO 2025: IPC's Growth and Future in India's Manufacturing Sector
04/23/2025 | Real Time with...IPC APEX EXPOGaurab Majumdar, VP for IPC in SE Asia and India, highlights IPC's impressive growth in India, with certification numbers rising significantly. The Indian manufacturing sector is projected to reach a $300 billion market, alongside a $10 billion investment in semiconductors. IPC is addressing industry demands through standards development and a new workforce project aimed at training students for job placements.
Real Time with... IPC APEX EXPO 2025: DuPont Electronics Materials and Innovations
04/23/2025 | Real Time with...IPC APEX EXPODuPont is many things to many markets, but DuPont Electronics Materials is, perhaps, a bit out of the DuPont "norm," developing specialized electronic materials that are particularly focused on challenging areas such as flex circuits, high power PCBs and products that must withstand harsh environments. At IPC APEX EXPO, Marcy LaRont sat down with Shannon Dugan from DuPont Electronics Materials to discuss some big news. They are being spun off into an independent entity with a new CEO having just been announced as the show wrapped.
IPC Releases Version 2.0 of IPC-2591, Connected Factory Exchange, with Expanded Device Coverage and Smarter Data
04/23/2025 | IPCIPC announces the release of IPC-2591, Connected Factory Exchange (CFX), Version 2.0, the global standard for plug-and-play, machine-to-machine, and machine-to-system communication for digital manufacturing.
IPC Rising Star Award: Feng Xue, IBM
04/22/2025 | Nolan Johnson, I-Connect007Feng Xue is a senior technical staff member in supply chain engineering at IBM. He has 21 years of experience in semiconductor technology and supply chain operations and leads initiatives on internal quality management systems, supplier quality programs, business analytics, app modernization and cloud-native apps for quality processes, IoT solution deployment, and Industrial 4.0 transformation, engineering skill development, and technical leadership development.