-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
One Model, One Solver: Altair and LG Electronics Develop All-in-One Analysis Solution to Significantly Extend Product Lifespans
July 31, 2024 | AltairEstimated reading time: 1 minute
Altair, a global leader in computational intelligence, and LG Electronics Vehicle component Solutions Company (LG VS Company) have collaborated to develop analysis solutions aimed at extending product lifespans. LG Electronics reduced the development time for their vehicle infotainment components by over 20% with the help of Altair OptiStruct – an optimization-enabled structural analysis software and key product in the Altair HyperWorks design and simulation platform.
Previously, LG Electronics relied on multiple software tools and models for fatigue damage evaluation during product development, leading to prolonged analysis times and complex model management. To streamline this process, Altair and LG Electronics have developed a multiphysics-based, integrated fatigue analysis solution.
“Our collaboration with LG Electronics enhances the prediction of its products’ safety and durability and accelerates advancements in various manufacturing industries, including electronic components,” said Sam Mahalingam, chief technology officer, Altair. “This effort further validates Altair’s leadership in electronics, helping our customers solve their toughest challenges and take ideas from concept to production faster than ever.”
Leveraging its experience in mass-producing, next-generation vehicle infotainment components, LG Electronics provided various cases to enhance the software's accuracy and reliability through learning and development. This collaboration allows users to identify and rectify potential issues at the design stage, significantly extending product lifespans. Furthermore, the integrated analysis process analyzes stress and strain in various environments for optimal designs, improving product durability and performance.
“Developing safe, high-quality automotive components for our OEM customers involves numerous tests, analyses, and verification processes,” said Sangyong Lee, head of the LG Electronics VS division research lab. “This collaboration combines LG Electronics' expertise with Altair’s AI-powered engineering technology, enhancing our competitiveness as a solution provider.”
Building on more than 25 years of innovation, OptiStruct is a proven, modern structural solver with comprehensive, accurate, and scalable solutions for linear and nonlinear analyses across statics and dynamics, vibrations, acoustics, fatigue, heat transfer, and multiphysics disciplines. It is used globally at industry-leading companies to drive design with optimization and validate structural performance. For the past two decades, OptiStruct topology optimization has driven the lightweight and structurally efficient designs of products you see and use every day. OptiStruct offers many other structural optimization methods and a broad range of essential manufacturing constraints for traditional processes, composites, and additive manufacturing.
Suggested Items
Boeing 20-Year Forecast Shows Steady Demand for Nearly 44,000 New Airplanes
06/15/2025 | BoeingEmerging markets, with expanding middle classes, dynamic and competitive airline networks and sustained aviation investment, will play an outsized role in global air traffic growth, helping drive a need for 43,600 commercial airplanes over the next 20 years, Boeing projected.
CACI Continues to Deliver Effective Mission Support to U.S. Africa Command
06/16/2025 | CACI International Inc.CACI International Inc announced that it has been awarded a seven-year task order, which includes one base period, plus six option periods, with an estimated ceiling of $437 million for support to U.S. Africa Command’s (USAFRICOM) mission.
Robotas Technologies Champions Innovation in Through-Hole Assembly with Mascot and VERIFY Systems
06/13/2025 | Robotas Technologies Ltd.While Surface Mount Technology (SMT) dominates today’s electronics manufacturing headlines, Robotas Technologies Ltd. continues to lead the charge in advancing Through-Hole Technology (THT) assembly.
ADCO Circuits Joins Forces with Scanfil
06/13/2025 | ADCO CircuitsADCO Circuits, a trusted provider of high-performance electronic assembly services, has sold a majority interest to Scanfil plc, Europe’s largest EMS company and a global leader in contract manufacturing.
Amtech Introduces Smarter, Cost-Optimized Prototyping Approach for PCB Assemblies
06/13/2025 | AmtechAmtech Electrocircuits, a leading provider of manufacturing solutions, has launched a smarter approach to prototyping that reduces cost and accelerates development for OEMs across industrial, medical, aerospace, and other high-mix, high-complexity sectors.