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Managing Energy Flow with Proper Stackup Design 

02/13/2025 | Andy Shaughnessy, Design007
At Design Con 2025, I had the opportunity to speak with Dan Beeker, technical director at NXP Semiconductor, about his technical session, which focused on optimizing PCB layers to best direct signal and power supply energy between these layers. In this interview, Dan discusses the complexities of board stackup and the significance of understanding dielectric layers for effective signal transmission. Dan is something of a “fields evangelist,” spreading the word about the need for designers to focus on fields, not just circuit theory. Toward the end, Dan summed up much of the design segment: Designing something that didn't make it break is not the same thing as designing it correctly. 

DesignCon 2025: Stacking the Professional Deck

02/05/2025 | Marcy LaRont, I-Connect007
After two full days of technical presentations, networking, and visiting with exhibitors on the show floor, the final day at DesignCon featured an exciting lineup of sessions and discussions, culminating in a wealth of knowledge for electronics professionals and included a thought-provoking keynote on global connectivity through low-earth orbit satellites presented by Amazon's Nima Mahanfar. Additionally, the Women in Engineering reception provided valuable insights on work-life balance and personal growth in the industry.

Optical Transceiver Shipments Projected to Grow by 56.5% in 2025

02/05/2025 | TrendForce
While DeepSeek has successfully reduced AI training costs, the broader cost reduction of AI models is expected to expand application scenarios and drive an increase in global data center deployments.

Keysight, KD Partner to Advance Multigigabit Optical Automotive Ethernet Testing with New Signal Analysis Capability

01/30/2025 | Keysight Technologies
Keysight Technologies, Inc. and KD, Inc., a fabless semiconductor company, have collaborated to create a comprehensive test for Multigigabit Optical Automotive Ethernet physical layer.

Beyond Design: Electro-optical Circuit Boards

01/22/2025 | Barry Olney -- Column: Beyond Design
Predicting the role of PCB designers in 10 years is a challenge. If only I had a crystal ball. However, we know that as technology progresses, the limitations of copper PCBs are increasingly apparent, particularly regarding speed, bandwidth, and signal integrity. Innovations such as optical interconnects and photonic integrated circuits are setting the stage for the next generation of PCBs, delivering higher performance and efficiency. The future of PCB design will probably incorporate these new technologies to address the challenges of traditional copper-based designs.
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