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U.S. Department of Commerce Announces $1.4 Billion in Final Awards to Support the Next Generation of U.S. Semiconductor Advanced Packaging

01/17/2025 | U.S. Department of Commerce
The U.S. Department of Commerce has announced that CHIPS National Advanced Packaging Manufacturing Program (NAPMP) has finalized $1.4 billion in award funding to bolster U.S. leadership in advanced packaging and enable new technologies to be validated and transitioned at scale to U.S. manufacturing.

onsemi Completes Acquisition of Qorvo’s Silicon Carbide JFET Technology Portfolio

01/16/2025 | onsemi
onsemi announced that it has completed its acquisition of the Silicon Carbide Junction Field-Effect Transistor (SiC JFET) technology business, including the United Silicon Carbide subsidiary, from Qorvo for $115 million in cash.

Infineon Strengthens Supply Chain with New Backend Fab in Thailand

01/16/2025 | Infineon
Infineon Technologies AG has broken ground for a new semiconductor backend production site in Samut Prakan, south of Bangkok, optimizing and further diversifying its manufacturing footprint. After an official meeting with the Prime Minister of Thailand, Paetongtarn Shinawatra, at the Government House, Infineon's Chief Operations Officer Dr. Rutger Wijburg launched the construction of the new fab today.

SIA Releases Policy Recommendations for Trump-Vance Administration and 119th Congress

01/16/2025 | SIA
The Semiconductor Industry Association (SIA) released a policy agenda setting forth the U.S. semiconductor industry’s policy priorities and suggested areas for collaboration with the Trump-Vance administration and the 119th Congress.

U.S. Department of Commerce Announces Preliminary Terms with MACOM to Help Strengthen Supply Chain Resilience for U.S. Defense and Telecommunications Industries

01/16/2025 | U.S. Department of Commerce
The U.S. Department of Commerce signed a non-binding preliminary memorandum of terms (PMT) with MACOM Technology Solutions Inc. (MACOM) to provide up to $70 million in proposed direct funding under the CHIPS and Science Act.
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