Global PCB Connections: Rigid-flex and Flexible PCBs—The Backbone of Modern Electronics
Flexible Thinking: The Key to a Successful Flex Circuit Design Transfer
Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4
onsemi Completes Acquisition of Qorvo’s Silicon Carbide JFET Technology Portfolio
January 16, 2025 | onsemiEstimated reading time: Less than a minute
onsemi announced that it has completed its acquisition of the Silicon Carbide Junction Field-Effect Transistor (SiC JFET) technology business, including the United Silicon Carbide subsidiary, from Qorvo for $115 million in cash.
The addition of SiC JFET technology will complement onsemi’s extensive EliteSiC power portfolio and enable the company to address the need for high energy efficiency and power density in the AC-DC stage in power supply units for AI data centers. In electric vehicle applications, SiC JFETs help improve efficiency and safety by replacing multiple components with a solid-state switch based on SiC JFET in battery disconnect units. In the industrial end-market, SiC JFETs enable certain energy storage topologies and solid-state circuit breakers.
“This acquisition further strengthens onsemi’s leadership in power semiconductors by providing disruptive and market leading technologies to our customers to solve their most pressing power density and efficiency problems in AI data centers, automotive and industrial markets,” said Simon Keeton, group president and general manager of the Power Solutions Group, onsemi. “We will continue to innovate and make investments to expand our technology leadership in providing the most comprehensive power system solutions.”
Share on:
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Siemens, UMC Collaborate to Advance EM/IR Drop Analysis with mPower Technology
07/22/2025 | SiemensSiemens Digital Industries Software announced that it has collaborated with United Microelectronics Corporation (UMC), a leading global semiconductor foundry, to implement Siemens' mPower™ software for electromigration (EM) and IR drop analysis, enabling chip designers to optimize performance and enhance reliability.
Epirus Receives $43.5 Million Contract from U.S. Army for IFPC-HPM Generation II Systems
07/18/2025 | PRNewswireEpirus announced a $43,551,060 contract from the U.S. Army's Rapid Capabilities and Critical Technologies Office (RCCTO).
Eaton Signs Agreement to Acquire Resilient Power Systems
07/16/2025 | BUSINESS WIREIntelligent power management company Eaton announced it has signed an agreement to acquire Resilient Power Systems Inc., a leading North American developer and manufacturer of innovative energy solutions, including solid-state transformer-based technology.
Beyond Design: Refining Design Constraints
07/17/2025 | Barry Olney -- Column: Beyond DesignBefore starting any project, it is crucial to develop a thorough plan that encompasses all essential requirements. This ensures that the final product not only aligns with the design concept but is also manufacturable, reliable, and meets performance expectations. High-speed PCB design requires us to not only push technological boundaries but also consider various factors related to higher frequencies, faster transition times, and increased bandwidths during the design process.
Copper Price Surge Raises Alarms for Electronics
07/15/2025 | Global Electronics Association Advocacy and Government Relations TeamThe copper market is experiencing major turbulence in the wake of U.S. President Donald Trump’s announcement of a 50% tariff on imported copper effective Aug. 1. Recent news reports, including from the New York Times, sent U.S. copper futures soaring to record highs, climbing nearly 13% in a single day as manufacturers braced for supply shocks and surging costs.