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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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TFE Acquires TEKENA USA, Expanding Particle Removal and Surface Cleaning Portfolio

09/16/2026 | TFE
TFE, a North American provider of manufacturing equipment, consumable products and technical solutions, announced the acquisition of TEKENA USA LLC, a provider of particle removal and surface cleaning technologies for precision manufacturing applications.

Foxconn Expands U.S. AI Footprint With California Property Acquisition

08/28/2026 | I-Connect007 Editorial Team
Foxconn is expanding its U.S. presence with the acquisition of land and a manufacturing facility in Santa Clara, California, as the electronics manufacturing giant continues to invest in AI-related business.

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08/26/2026 | IBM
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Infineon Acquires C2i Semiconductors to Boost AI Data Center Power Solutions

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TTM Technologies to Acquire Epiq Solutions to Expand Advanced Technology Offerings

08/17/2026 | Globe Newswire
This acquisition reinforces TTM’s Strategy to Drive Long-Term Sustainable Results for Shareholders. TTM continues to balance its portfolio with investments for growth in fast growing markets.
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