American Made Advocacy: The Administration Changed, but Our Industry’s Needs Remain
The Government Circuit: News on Defense Electronics, Europe, and Sustainability
Defense Speak Interpreted: SWaPing Nanosatellites for Defense Systems
AIM Solder Joins International Electronics Manufacturing Initiative (iNEMI)
May 29, 2024 | AIMEstimated reading time: 1 minute
AIM Solder, a leading global manufacturer of solder assembly materials, is proud to announce its membership with the International Electronics Manufacturing Initiative (iNEMI). This strategic alliance underscores AIM Solder’s commitment to advancing the electronics manufacturing industry through collaboration and innovation.
iNEMI, a not-for-profit consortium, brings together the world’s leading electronics manufacturers, suppliers, associations, government agencies, and universities. Its mission is to forecast and accelerate improvements in the electronics manufacturing industry, addressing technology and infrastructure gaps through high-impact projects and proactive forums. iNEMI implements a global agenda, focusing on eliminating technology and infrastructure gaps through collaborative projects and industry forums.
“Joining iNEMI aligns perfectly with our mission to offer innovative and reliable product solutions to the electronics industry,” said Tim O’Neill, Director of Product Management at AIM Solder. “We are excited to collaborate with other industry leaders to drive advancements and support the development of cutting-edge technologies.”
As part of iNEMI, AIM Solder will engage in various projects focused on critical areas related to solder materials, electronics manufacturing, sustainable electronics, and more. These initiatives will not only benefit AIM Solder’s product development efforts but also contribute to the overall progress of the global electronics manufacturing landscape.
Share on:
Suggested Items
sureCore Now Licensing its CryoMem Range of IP for Quantum Computing
11/26/2024 | sureCoresureCore, the memory specialist, has announced that it is now licensing its CryoMem™ suite of Memory IP that is designed for use at the extremely low temperatures required for Quantum Computing (QC) applications.
IPC Japan Puts More Focus on Collaboration, Standards Development, Advanced Packaging
11/26/2024 | Yusaku Kono, IPC Japan RepresentativeIn the past year, IPC has strengthened its relationships with key Japanese companies and government bodies. This was accomplished, in part, by a visit to Japan this past summer, where members of the IPC Asia team, punctuated by standards committee work last winter, forged stronger ties with government officials and companies involved in electronics manufacturing.
Subdued Electronics Industry Sentiment Continues in November
11/25/2024 | IPCIPC releases November 2024 Global Sentiment of the Electronics Manufacturing Supply Chain report
NEOTech Significantly Improves Wire Bond Pull Test Process
11/25/2024 | NEOTechNEOTech, a leading provider of electronic manufacturing services (EMS), design engineering, and supply chain solutions in the high-tech industrial, medical device, and aerospace/defense markets, proudly announces a major advancement in its wire bond pull testing process, reducing manufacturing cycle time by more than 60% while maintaining industry-leading production yields of over 99.99%.
PCB Design Software Market Expected to Hit $9.2B by 2031
11/21/2024 | openPRThis report provides an overview of the PCB design software market, detailing key market drivers, challenges, technological advancements, regional dynamics, and future trends. With a projected compound annual growth rate (CAGR) of 13.4% from 2024 to 2031, the market is expected to grow from $3.9 billion in 2024 to $9.2 billion by 2031.