-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueSales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
The Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
GlobalFoundries Commits to Achieving Net Zero Emissions and Carbon-Neutral Power by 2050
April 23, 2024 | GlobalFoundriesEstimated reading time: 2 minutes
GlobalFoundries (GF) is furthering its commitment to sustainable operations and fighting climate change with the announcement of two new long-term goals to achieve net-zero greenhouse gas (GHG) emissions and 100% carbon-neutral power by 2050.
The new 2050 goals are aligned with Paris Agreement goals, and build upon GF’s Journey to Zero Carbon pledge in 2021 to reduce its greenhouse gas emissions by 25% from 2020 to 2030, even as the company continues to expand its global manufacturing capacity. Net-zero is the widely accepted international goal for mitigating global warming in the second half of the century, and calls for companies to reduce GHG emissions to keep the global rise in temperature below 2°C above pre-industrial times.
Since 2021, GF has initiated energy efficiency improvements and implemented multiple projects employing alternative chemistries and abatement controls across its global semiconductor manufacturing operations. GF has also signed multiple agreements to improve the energy efficiency of onsite systems and reduce carbon emissions from electricity production. GF is on track to meet its 25% reduction goal by 2030, and is now taking the next step by setting a net zero goal for 2050.
“Climate change is a universal concern for every nation, company and person on this planet, and there are no do-overs when it comes to global warming. It is incumbent upon all of us to take meaningful action to fight against this risk,” said Dr. Thomas Caulfield, president and CEO of GF. “With our net zero 2050 goal, GF is pledging to continue our sustainability journey and innovate new ways of reducing our emissions and our overall impact on the environment. Not only does this make sense and drive value from a business perspective, it’s the right thing to do for our planet and the future of humanity.”
To achieve its net zero 2050 goal, GF will further reduce emissions through the continued use of state-of-the-art emissions controls when expanding its manufacturing footprint, installation of new controls on existing sites where appropriate, expanded use of alternative chemistries, and achieving 100% carbon-neutral power. The company is also working with suppliers and partners to further reduce and remove emissions across GF’s value chain.
GF’s net zero 2050 goal is the latest example of the company’s longstanding commitment to sustainable operations. Recent recognitions of these efforts include being named to Morningstar Sustainalytics’ “2024 Top-Rated ESG Companies,” maintaining a “Prime” corporate ESG performance rating in 2023 from ISS, and being named to Newsweek’s 2023 and 2024 lists of “America’s Most Responsible Companies.”
Suggested Items
Silicon Mountain Contract Services Enhances SMT Capabilities with New HELLER Reflow Oven
07/17/2025 | Silicon Mountain Contract ServicesSilicon Mountain Contract Services, a leading provider of custom electronics manufacturing solutions, is proud to announce a significant upgrade to its SMT production capability with the addition of a HELLER 2043 MK5 10‑zone reflow oven to its Nampa facility.
KONIG Launches KP400: Advanced 3D Digital Conformal Coating System for High-Density Electronics
07/15/2025 | KONIGKONIG, a leader in electronic packaging protection solutions, is proud to announce the launch of the KP400 3D Digital Packaging Solution—a breakthrough conformal coating system that brings new levels of precision, speed, and material efficiency to electronics manufacturing.
Electronics Manufacturing & Assembly Collaborative (EMAC) Announces Innovative Student Competition
07/15/2025 | EMACThe Electronics Manufacturing & Assembly Collaborative (EMAC) recently announced the launch of the Bright Manufacturing Challenge 2025, a revolutionary hands-on competition that transforms how students experience electronics manufacturing and robotics engineering.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
07/11/2025 | Andy Shaughnessy, Design007 MagazineThis week, we have quite a variety of news items and articles for you. News continues to stream out of Washington, D.C., with tariffs rearing their controversial head again. Because these tariffs are targeted at overseas copper manufacturers, this news has a direct effect on our industry.I-Connect007 Editor’s Choice: Five Must-Reads for the Week
Infineon Advances on 300-millimeter GaN Manufacturing Roadmap as Leading Integrated Device Manufacturer (IDM)
07/10/2025 | InfineonAs the demand for gallium nitride (GaN) semiconductors continues to grow, Infineon Technologies AG is poised to capitalize on this trend and solidify its position as a leading Integrated Device Manufacturer (IDM) in the GaN market.