-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Essential Guide to Surface Finishes
We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
It's Show Time!
In this month’s issue of PCB007 Magazine we reimagine the possibilities featuring stories all about IPC APEX EXPO 2025—covering what to look forward to, and what you don’t want to miss.
Fueling the Workforce Pipeline
We take a hard look at fueling the workforce pipeline, specifically at the early introduction of manufacturing concepts and business to young people in this issue of PCB007 Magazine.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
Benmayor to Exhibit Technosystem Automation at IPC APEX EXPO 2024
March 25, 2024 | BenmayorEstimated reading time: Less than a minute
Benmayor will exhibit Technosystem Automation at the IPC APEX EXPO 2024, a world-class trade show and cutting-edge technical conference in Anaheim, California, April 6-11, in booth 4432 at Burkle North America (Schmoll).
Technosystem will present highly advanced automation concepts for the PCB industry, featuring Technosystem V3 LDI. This automation is specifically designed for mid-size PCB factories with a high mix and a substantial layer count, where delicate handling is paramount.
The new automation featured at the show will automate the Solder Mask or Dry Film Schmoll MDI Direct Imaginer. The Technosystem V3 LDI can automate all DI or LDI on the market and is equipped with a fully integrated protocol with the ability to manage job queues and make changes without downtime. All Technosystem Automations are prepared for the Industry 4.0.
Visit us at booth 4432 at Burkle North America (Schmoll) to learn more about Technosystem Automation from Benmayor. We look forward to speaking with you.
Suggested Items
European Chips Skills Academy Launches ECS Summer School 2025 to Inspire Future Electronics Talent
04/01/2025 | JCN NewswireThe European Chips Skills Academy (ECSA), an EU-funded project coordinated by SEMI Europe, in collaboration with industry partners AENEAS, EPoSS, and INSIDE, has announced the launch of the ECS Summer School 2025.
Real Time with... IPC APEX EXPO 2025: Highlighting Global PCB Trends and Technologies with all4-PCB
04/01/2025 | Real Time with...IPC APEX EXPOAndy Shaughnessy and all4-PCB's Ralph Jacobo discuss global distribution trends in the PCB industry, focusing on new technologies in plasma etching and final inspection. Ralph highlights the importance of IC substrate buildup technology and partnerships in the market.
Do You Have X-ray Vision? SMT007 Magazine April Issue Is No Joke
04/01/2025 | I-Connect007 Editorial TeamAs component packaging continues to evolve, the capability of inspecting through components is crucial. Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question—and others—to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: We’ve Got It Covered
04/01/2025 | I-Connect007 Editorial TeamIPC APEX EXPO is the largest electronics manufacturing trade show in North America, bringing together professionals from all sectors of the supply chain to educate, network, and share their products and services. We’ve put all our coverage of the show in one easy-to-find location. Just click on “Videos,” “Show Coverage” and “Photos” to find what you’re looking for. Check back regularly as more content is added. You won’t want to miss any of our unique coverage.
Real Time with... IPC APEX EXPO 2025: Akrometrix—Creative Approaches to Measuring Thermal Warpage
03/31/2025 | Real Time with...IPC APEX EXPONeil Hubble discusses his research on measuring thermal warpage which focuses on challenges in testing small, thin samples. He introduces non-destructive testing methods that effectively measure without damaging components. Neil highlights the industry's growing interest in AI and outlines future technology goals, including improved resolution and automation to enhance production efficiency.