-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueFueling the Workforce Pipeline
We take a hard look at fueling the workforce pipeline, specifically at the early introduction of manufacturing concepts and business to young people in this issue of PCB007 Magazine.
Inner Layer Precision & Yields
In this issue, we examine the critical nature of building precisions into your inner layers and assessing their pass/fail status as early as possible. Whether it’s using automation to cut down on handling issues, identifying defects earlier, or replacing an old line...
Engineering Economics
The real cost to manufacture a PCB encompasses everything that goes into making the product: the materials and other value-added supplies, machine and personnel costs, and most importantly, your quality. A hard look at real costs seems wholly appropriate.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
imec Inks MoU with the intention to Establish New 300mm R&D Process Line in Spain for Specialized Chip Technologies
March 20, 2024 | ImecEstimated reading time: 1 minute
The Spanish government, together with the regional government of Andalusia and imec, a world-leading research and innovation hub in nanoelectronics and digital technology, announced that they have signed a Memorandum of Understanding (MoU) outlining their intent to establish a specialized chip technology pilot line in Malaga (Andalusia). The new innovation facility intends to complement imec’s existing 300mm advanced CMOS process line in Leuven, Belgium, with new 300mm processes developments and the introduction of new materials that are difficult to combine today with standard CMOS processes. The new facility aims to answer the industry’s need for R&D, prototyping and pave the road to the manufacturing of promising, new technologies.
The facility aims to leverage the unique advantages of leading-edge 300mm semiconductor process technology to drive new applications in health care, life sciences, photonics, augmented and virtual reality, precision sensing, ... Complementing the existing expertise and infrastructure in Leuven with non-standard processes that are currently incompatible with semiconductor manufacturing processes, the two sites are meant to be closely linked.
The negotiations will now start with an eye to finding a strong public-private cooperation model, between imec, the Spanish government and the government of Andalusia. The governments already agree to support the construction of the new facility including the advanced equipment. They have also formulated the intention to financially support the pilot line’s operations in a sustainable, long-term manner, to the benefit of its growing semiconductor ecosystem. Imec intends to manage the operations, provide the required knowledge and technology, and guarantee access to its global academic and industrial partner network.
This MoU emphasizes the partners’ ambition to collaborate on a pan-European scale to contribute to the Spanish semiconductor ecosystem. It builds on local strengths, yet leverages cross-border expertise and capabilities to address global societal challenges, while supporting regional economic ambitions. By establishing this new facility, which is closely connected to imec's Leuven-based 300mm pilot line, the goal is to fully harness the innovation potential in Spain and Andalusia. Further details of the operations of the facility, such as hiring prospects, cannot be confirmed yet as they will be concluded in ensuing discussion.
Suggested Items
ElectroCraft Expands Ann Arbor Facility to Strengthen U.S. Manufacturing Independence and Reduce Lead Times
01/30/2025 | PRNewswireElectroCraft, a global leader in motor and motion control solutions, proudly announces the significant expansion of its Ann Arbor, Michigan facility.
SIA Applauds CHIPS Act Incentives for Infinera, Corning, Edwards Vacuum, and GlobalFoundries
01/20/2025 | SIAThe Semiconductor Industry Association (SIA) today released the following statement from SIA President and CEO John Neuffer commending a series of CHIPS and Science Act agreements announced by the U.S. Department of Commerce.
U.S. Department of Commerce Announces $1.4 Billion in Final Awards to Support the Next Generation of U.S. Semiconductor Advanced Packaging
01/17/2025 | U.S. Department of CommerceThe U.S. Department of Commerce has announced that CHIPS National Advanced Packaging Manufacturing Program (NAPMP) has finalized $1.4 billion in award funding to bolster U.S. leadership in advanced packaging and enable new technologies to be validated and transitioned at scale to U.S. manufacturing.
Micron Breaks Ground on New HBM Advanced Packaging Facility in Singapore
01/10/2025 | MicronMicron Technology, Inc. broke ground today on a new High-Bandwidth Memory (HBM) advanced packaging facility adjacent to the company’s current facilities in Singapore.
Biden-Harris Administration Announces Arizona State University Research Park as Planned Site for Third CHIPS for America R&D Flagship Facility
01/08/2025 | U.S. Department of CommerceThe Department of Commerce and Natcast announced the Arizona State University (ASU) Research Park in Tempe, Arizona as the anticipated location for the third flagship CHIPS for America research and development (R&D) facility.