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For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
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We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
The Essential Guide to Surface Finishes
We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
March 15, 2024 | Andy Shaughnessy, Design007 MagazineEstimated reading time: 2 minutes

Good morning! How are you all doing today? I need another cuppa Joe!
It was a busy week in PCB design and manufacturing. This has been a pretty “dense” week, and this week’s Top Five features an article on density equations by Happy Holden, and a news item about the SMTA UHDI symposium in Phoenix. We also have news about our latest podcast, and a Chris Mitchell column about economic security here and abroad. And Todd Kolmodin discusses the ins and out of 4-wire Kelvin testing, and he tells us a little about Lord Kelvin himself.
It’s trade show season, and we’ll be covering SMTA shows in Dallas and Phoenix, as well as IPC APEX EXPO. We hope to see you on the road.
Happy’s Tech Talk #26: Balancing the Density Equation
Published March 14
This is a great article on density, by Happy Holden, “Mr. HDI.” If you need to figure out wiring demand and substrate capacity, look no further. Happy breaks it all down in layman’s terms, which is nice, because this can be a pretty “dense” topic.
SMTA Announces Workforce Development Breakfast at Ultra High Density Interconnect (UHDI) Symposium
Published March 13
UHDI has been gaining traction for the last few years, and it’s only fitting that SMTA is holding a symposium in Phoenix that’s dedicated to designing and manufacturing these tiny lines and spaces. This will be a good show, so if you’re in the Phoenix area, check it out.
New Episode Now Available: Designing for Reality—CAM, Materials, and Imaging
Published March 14
Our podcasts have really taken off, and our latest “pod” is no exception. In this episode, ASC Sunstone VP/Manager Matt Stevenson discusses DFR—Designing for Reality. Isn’t that what PCB design is all about in the first place?
The Government Circuit: Driving Resiliency and Economic Security on Both Sides of the Atlantic
Published March 12
In this column, Chris Mitchell discusses the DoD’s “strategy for industrial strength,” and IPC’s latest lobbying efforts in Washington. IPC’s government relations folks are doing a job that I wouldn’t want to do. They really stay on top of these politicians and hold them to their word, because they’ll promise us the moon and stars during an election year.
Testing Todd: Why 4-wire Kelvin?
Published March 8
Why should you use 4-wire Kelvin? Todd Kolmodin has an answer to this question. In this column, Todd explains how 4-wire Kelvin testing has found a new home in the high-speed substrate, HDI, and microwave markets.
Suggested Items
Global Semiconductor Sales Increase 18.8% in Q1 2025 Compared to Q1 2024; March 2025 Sales up 1.8% MoM
05/06/2025 | SIAThe Semiconductor Industry Association (SIA) announced global semiconductor sales were $167.7 billion for the first quarter of 2025, an increase of 18.8% compared to the first quarter of 2024 but 2.8% less than the fourth quarter of 2024.
Aspocomp Reports Strong Q1 2025: Significant Sales Growth and Return to Profitability
04/30/2025 | AspocompAspocomp Group Plc announced its interim report for the first quarter of 2025, demonstrating a significant turnaround with substantial increases in both order book and net sales, and a clear return to profitability.
Real Time with... IPC APEX EXPO 2025: The Role of AI in Advanced Packaging
04/30/2025 | Real Time with...IPC APEX EXPOIn a follow-up to his keynote, Dr. Ahmad Bahai, discusses the critical intersection of advanced packaging, computing, and AI in semiconductor innovation with Nolan Johnson and Devan Iyer. He emphasizes the need for new approaches to handle the data economy and highlights AI's role in optimizing electronics manufacturing. The conversation covers challenges in power and thermal management, the impact of AI on EDA tools, and bio-inspired innovations. Predictions about future trends point towards increased efficiency in design and manufacturing.
North American PCB Industry Shipments Down 3.1% in March
04/28/2025 | IPCIPC announced the March 2025 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.24.
North American EMS Industry Up 0.2 Percent in March
04/25/2025 | IPCIPC announced today the March 2025 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.37.