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High Density Packaging User Group Announces Gold Circuit Electronics Membership
February 6, 2024 | HDP User GroupEstimated reading time: Less than a minute
High Density Packaging User Group (HDP) is pleased to announce that Gold Circuit Electronics (GCE) has become a member.
"GCE is a top 25 printed circuit board manufacturer with top Fortune 100 OEM customers in the server, AI, data center, cloud, storage, switch, router, base station, telecom, automotive, industrial and medical markets supply. Our tech range has grown significantly in the last 5+ years to include a large percentage of business in the advanced tech space", said Joseph Beers, Senior Vice President at GCE. “Joining HDPUG is a strategic decision to increase our presence in this community and contribute, learn, and collaborate meaningfully to help our business alignment in the markets and with the customers we serve.”
"I am pleased to welcome GCE to HDP, joining the outstanding companies working on HDP User Group projects. Their expertise and capability in PWB fabrication for high performance electronics, especially those focused on next-generation servers and networking products, will contribute significantly to several of our emerging technology projects", said Larry Marcanti, Executive Director of HDP User Group.
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