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Microsembly Furthers RF Hybrid Manufacturing Services with New Automated Wire Bonding and Die Attach Equipment

05/30/2025 | Microsembly
Microsembly, a US-based provider of high-frequency contract manufacturing services, has announced the addition of new state-of-the-art automated and manual wire and ribbon bonders to its advanced RF and microwave assembly, manufacturing, and testing facility.

Amphenol Printed Circuits Brings Its Boards to the 2025 IMSI

05/29/2025 | Amphenol Printed Circuits
Amphenol Printed Circuits will be offering a small but impressive sample of its vast design, manufacturing, and test capabilities in Radio Frequency (RF) printed circuit boards (PCBs) Rigid-Flex/Flex and backplanes at the 2025 IEEE MTT-S International Microwave Symposium exhibition.

Beyond Design: Radiation and Interference Coupling

05/21/2025 | Barry Olney -- Column: Beyond Design
Radiation and interference coupling pose significant challenges to the performance and reliability of high-speed digital designs. Whether it's the unintended emission of electromagnetic waves or the interaction of signals between adjacent circuits, these phenomena can lead to unwanted noise, signal distortion, and even system malfunctions. Understanding the mechanisms behind radiation and interference coupling is crucial for electronics designers seeking to design robust and efficient systems.

Merlin Circuit Technology Earns NADCAP 2nd Year Merit

05/13/2025 | Merlin Circuit Technology
Merlin Circuit Technology Ltd, a leading manufacturer of advanced printed circuit boards (PCBs) for mission-critical applications, has announced the successful completion of its latest NADCAP audit, achieving prestigious 2nd Year Merit Status.

StratEdge LPA-Series Semiconductor Packages Take Center Stage at CS Mantech and Space Tech Expo USA

05/07/2025 | StratEdge
StratEdge Corporation will display its thermally efficient Leaded Power Amplifier (LPA) packages in Booth 805 at CS Mantech.
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