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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Suggested Items

A University Model for Training the Next Generation of PCB Designers

08/19/2026 | Marcy LaRont, I-Connect007
Veteran PCB designer and educator John Watson has building one of the nation's most comprehensive university-based PCB design certificate programs in the country. He’s working with Palomar College, UC San Diego, UC Santa Cruz, and UMass Lowell to teach the complete design-to-manufacturing process while connecting students with internships and career opportunities. I spoke with John about the industry's workforce challenges, building meaningful educational pathways, and why the next generation of PCB designers may come from places few would expect.

PCB West Panel to Take On What’s Next for PCB Design

08/19/2026 | PCEA
The Printed Circuit Engineering Association (PCEA) has announced a panel discussion on the technologies reshaping printed circuit board design over the next two to five years will take place at PCB West 2026.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

08/14/2026 | Marcy LaRont, I-Connect007
Another week has flown by, and it’s time for the must-read articles and news highlights. This week, I’m putting a spotlight on FUJI PCB and FS Quality, through an interview by Dan Beaulieu with President Tianming Liu, and “the rest of the story” from the EIPC Summer Conference technical sessions. I’m also focusing on a new marketing book by Brittany Martin, and there’s rarely a week when we don’t talk about AI, so I also chose Sean Patterson’s most recent practical advice for PCB fabricators. Though the U.S. has placed a “stay” on CMMC Level 2 certification, it’s still coming for you and your business. If you work in the Mil/Aero space in the U.S., check out what Omega EMS has done to accelerate its compliance. Their wisdom may be worth your time.

Carano and ElectronicsU Debut New Course on Advanced Packaging

08/13/2026 | Nolan Johnson, I-Connect007
Mike Carano is an industry pioneer with deep expertise across multiple domains. In his latest course for the Global Electronics Association’s ElectronicsU platform, “Advanced Packaging: HDI Enabling Technology,” Carano delivers some of the first educational material introducing advanced packaging to the printed circuit supply chain. In this interview, he discusses the course content, target audience, and motivation for creating the course. 

Catching Up With FUJI PCB and FS Quality’s President, Mr. Tianming Liu

08/13/2026 | Dan Beaulieu
I recently interviewed Mr. Tianming Liu, founder of FUJI PCB and FS Quality. His company is built by blending Japanese manufacturing discipline, Chinese execution speed, and an unwavering commitment to quality and customer service. His story is anything but ordinary. From studying and working in Japan for more than a decade to transforming a struggling PCB factory into a profitable operation before launching FUJI PCB, he has shown vision, determination, and continuous innovation.
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