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New Breakthrough in Double-Sided Reflow Part Retention from Alltemated

07/19/2024 | Alltemated
Alltemated's PLACE-N-BOND™ underfilm passed testing and was implemented in volume production to aid in component retention during the second pass reflow of printed circuit assemblies. This successful testing and implementation occurred in various applications with components such as capacitors, inductors, transformers, connectors, and larger ICs.
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