American Made Advocacy: Rebuilding America’s Military Stockpiles Begins With Microelectronics
The Right Approach: The End of an Era—DoD Proposes MIL-PRF-31032 Cancellation
Defense Speak Interpreted: Hypersonics Report Back After Six Years of Silence
TRI to Unveil New High-Throughput AOI and AXI at productronica 2023
September 15, 2023 | TRIEstimated reading time: 1 minute
Test Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, will join productronica 2023, which will be held at Messe München Center from November 14 – 17, 2023. Visit booth No. A2-139 to experience TRI's newly released test and inspection solutions.
TRI will unveil the newly released Ultra-High-Speed 3D AOI, TR7700QH SII, capable of inspecting at speeds of up to 80 cm²/sec, maintaining uncompromised Gauge R&R. The TR7700QH SII is powered by TRI's Smart Programming, AI Algorithms, and Metrology measurement capabilities. Also exhibiting will be the newly released high throughput 3D AXI, TR7600 SV, which offers up to 20% performance improvement compared to the award-winning TR7600 series. Powered by AI Algorithms, the high-speed 3D AXI can precisely detect Void defects.
TRI will showcase the newly released high-speed multi-angle 3D AOI, TR7500QE Plus, equipped with four 20MP side cameras and 1 top high-resolution camera. TRI's lineup will include the enhanced 3D SPI TR7007DI Plus, the high-end 3D AXI TR7600F3D SII, and the Multi-core ICT with In-System LED Analysis function TR5001Q SII INLINE.
The AI solutions from TRI include the AI training tool, the AI Station, Verify Host, AI Smart Programming, and more. TRI Test and Inspection solutions comply with Industry 4.0 standards like the IPC-Hermes-9852, IPC-CFX, and IPC-DPMX.
TRI invites you to visit booth No. A2-139 at productronica 2023. Don't miss the opportunity to discuss with our experts how TRI solutions can enhance your production yield rate, reduce operational costs, and increase efficiency.
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/08/2026 | Marcy LaRont, I-Connect007This week, I’ve selected some outstanding interviews that you’ll want to take note of. First, is a roundtable discussion featuring three dynamic industry cybersecurity experts. Please watch this important discussion that affects us all. Following that, I spotlight the IPC-2581 Consortium, which explains why IPC-2581 is the standard to replace Gerber data for manufacturing. Next, I am including my interview with PCBAA and AAM, who collaborated to release a short documentary on U.S. PCB manufacturing.
Global Electronics Association to Testify at the Office of the U.S. Trade Representative Panel on Section 301 Structural Excess Capacity
05/08/2026 | Global Electronics AssociationChris Mitchell, Vice President for Global Government Relations at the Global Electronics Association, will testify before the Office of the U.S. Trade Representative (USTR) Panel on Section 301 Structural Excess Capacity on Friday, May 8.
Hall of Fame Spotlight Series: Highlighting Karen McConnell
05/07/2026 | Dan Feinberg, I-Connect007In 2021, Karen McConnell was awarded the Raymond E. Pritchard Hall of Fame award in recognition of her contributions to the Association and the electronics industry. As a senior staff member and CAD/CAM engineer at Northrop Grumman Enterprise Services, her primary responsibility was to develop a common, shared EDM (Electronic Document Management) library to support the electrical and PCB design tool initiatives across Northrop Grumman Mission Systems.
A Necessary Shift From Gerber to IPC-2581
05/07/2026 | Tracy Riggan, Global Electronics AssociationIPC-2581 is an open, vendor-neutral data exchange standard developed by the Global Electronics Association to streamline the exchange of PCB design information across fabrication, assembly, and test. It replaces multiple legacy formats—including industry standards, Gerber, and ODB++—with a single, comprehensive, XML-based dataset that captures all manufacturing details.
TTC-LLC and TTCI: Smarter Training, Stronger Test at PCB East 2026
04/27/2026 | The Test Connection Inc.The Training Connection LLC (TTC-LLC) and The Test Connection, Inc. (TTCI) will be exhibiting together at PCB East 2026, taking place April 28–May 1 at the DCU Convention Center in Worcester, Massachusetts. Attendees can find both teams at Booth #103 during the main exhibition day on Wednesday, April 29.