It’s Only Common Sense: Customers Capabilities—and Confidence
Dan’s Biz Bookshelf: ‘The 'NVIDIA Way: Jensen Huang and the Making of a Tech Giant’
Nordson TEST & INSPECTION Showcases Inspection and Metrology Solutions at SEMICON Taiwan
August 28, 2023 | Nordson Test & InspectionEstimated reading time: 1 minute
Nordson TEST & INSPECTION announced its participation in SEMICON Taiwan, one of the most anticipated events in the semiconductor industry. The company will be showcasing its state-of-the-art inspection and metrology solutions, including the CyberOptics SQ3000™+ Multi-Function system, the new Quadra 7 Pro Manual X-ray Inspection (MXI) System, and the revolutionary WaferSense® Auto Teaching System™ (ATS2). The event will take place from Sept. 6-8, 2023 at TaiNEX 1&2 in Taipei.
The new Quadra 7 Pro MXI system sets a new standard for 3D/2D manual inspection in back-end semiconductor applications. Powered by the revolutionary Onyx® detector technology, it delivers exceptional image clarity and reduced noise levels, elevating the inspection experience to new levels of precision and efficiency.
Equipped with the latest Dual Mode Quadra NT4® tube, the Quadra 7 Pro provides users with maximum flexibility. This innovative feature offers brightness and resolution modes, allowing operators to dynamically switch between them based on specific application requirements.
Enhancing the Quadra 7 Pro's capabilities is the newly developed Revalution™ software, tailored specifically for high-end semiconductor applications. With an intuitive interface, optimized workflow, and expanded functionality, Revalution™ software empowers operators to efficiently analyze and interpret inspection data, contributing to faster decision-making and improved overall productivity.
The CyberOptics SQ3000™+ Multi-Function system is designed for high-end applications, including advanced packaging, mini-LED, advanced SMT, and 008004/0201 SPI. This all-in-one solution offers unmatched accuracy and high speed, utilizing an even higher resolution Multi-Reflection Suppression® (MRS®) sensor that effectively eliminates reflection-based distortions caused by shiny components and specular surfaces.
The WaferSense® Auto Teaching System™ (ATS2) is a multi-camera sensor that, when used in conjunction with CyberSpectrum™ software, enables accurate wafer hand-off calibration for semiconductor tool alignment and setup for front-end semiconductor fab environments. With the ability to capture three-dimensional offset data (x, y, and z) in real-time, ATS2 simplifies wafer position teaching without the need to open the tools. This results in repeatable and reproducible setups, streamlined maintenance checks, accelerated troubleshooting, and reduced technician-to-technician variation, leading to significant yield improvements and enhanced productivity for semiconductor fabs worldwide.
To witness the future of advanced inspection and metrology technology, visit booth #L0800 on the 4th floor at SEMICON Taiwan 2023, and explore Nordson TEST & INSPECTION's range of industry-leading solutions.
Share on:
Testimonial
"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."
Simon Khesin - Schmoll MaschinenSuggested Items
Webinar Review, Part 2: Building the AI Backbone at IBM on Systems-level Packaging
04/20/2026 | Marcy LaRont, I-Connect007The second presentation in a recent Global Electronics Association’s Executive Pulse webinar series widened the lens on advanced packaging, moving beyond the component level to a systems-level view of how AI is reshaping the electronics landscape. Building on Dr. Hemanth Dhavaleswarupu of AMD’s previous discussion of chip-level packaging innovation, Dr. Jung Yoon of IBM explored the broader infrastructure implications, from the data center floor to the global supply chain.
Cadence, NVIDIA Expand AI & Accelerated Computing Partnership
04/17/2026 | Cadence Design Systems, Inc.At CadenceLIVE Silicon Valley 2026, Cadence announced an expanded partnership with NVIDIA to deliver accelerated solutions across agentic AI, physics-based simulation and digital twins to unlock new levels of productivity and accelerate next‑generation engineering design flows across semiconductor design, physical AI systems and hyperscale AI factories.
Below the Surface: Looking Ahead to Where Integration Actually Happens
04/20/2026 | Chandra Gupta -- Column: Below the SurfaceProgress in RF rarely arrives and suddenly rewrites the rules. What actually moves performance forward almost always happens in the seams, the interfaces, the choices that determine whether individual parts are allowed to work together, or forced to fight one another. So, when we look ahead in RF systems—from DC through millimeter-wave—the most important conversations aren’t about isolated materials or heroic devices. They’re about integration, and more specifically, about how ceramic-based RF packages and module architectures shape system-level behavior long before the signal ever reaches free space.
From AI to AEP, an Impressive Array of Keynotes at APEX EXPO 2026
04/17/2026 | Marcy LaRont and Nolan Johnson, I-Connect007Each year at APEX EXPO, the Global Electronics Association provides an impressive lineup of keynote speakers to kick off the largest electronics manufacturing event in North America. This year included four keynote speeches, on topics ranging from the promise and peril of AI to the power of electronics, quantum computing, and the importance of heterogeneous integration in advanced electronics packaging.
ESD Alliance Reports Electronic System Design Industry Posts $5.5 Billion in Revenue in Q4 2025
04/15/2026 | SEMIElectronic System Design (ESD) industry revenue increased 10.3% to $5,466.3 million in the fourth quarter of 2025 from the $4,955.2 million registered in the fourth quarter of 2024, the ESD Alliance, a SEMI Technology Community, announced today in its latest Electronic Design Market Data (EDMD) report.