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From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
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Equipment Technologies LLC Launches New Website for New Equipment Sales and Maintenance Services
August 7, 2023 | Equipment Technologies LLCEstimated reading time: 2 minutes

Equipment Technologies LLC (ETI) has launched a redesigned “from the bottom up” website as it continues its rapid growth. ETI specializes in selling and installing new manufacturing and automation equipment as well as offering maintenance and repair services to the circuit board industry. ETI product and service offerings are supported by Insulectro, the largest distributor of materials and services for PCB manufacturers in North America. ETI is owned by the Redfern Companies in Southern California.
“I am thrilled to invite you to visit our new website at www.equiptech.com. It’s a complete re-design with all new visuals that show, first-hand, ETI specialists at work,” commented Jon Pelletier, ETI President. “It’s a fresh, sleek new look that truly reflects our company and its prominence within the industry. We are continuously searching out new opportunities for growth and expansion.”
The new website offers an array of pertinent information readily available in a simple to navigate design. Menu tabs include a “Featured Suppliers” section where visitors can learn about ETI’s two major equipment lines: Universal Circuit Board Equipment Co., Ltd. (UCE) and InduBond® Technologies.
UCE is a well-respected manufacturer of DES (Develop Etch Strip) Lines, SES (Strip Etch Strip) Lines, and VCP (Vertical Continuous Plating) Lines.
InduBond® Technologies manufactures a state-of-the art induction press and many automation add-ons that are revolutionizing fabrication shops. InduBond® X-PRESS lamination presses utilize a different way of producing the heat required for lamination using standard pressing methods. The innovation of this technology is that it produces heat on the laminated material, and only the laminated material, of each layer of the press pack at the same time, at the same temperature level, without any thermal conduction.
Other sections of the site include service & installation videos, company history, an enhanced contact form, and a news and career section.
Patrick Redfern, President & CEO of the Redfern Companies commented, “Through its equipment offerings, ETI supports our customers as they automate their manufacturing process. The equipment and service they offer is unmatched in our industry and it’s a perfect complement to the best-in-class PCB materials and chemistry we offer through other channels. I am excited as well to invite you to discover the capabilities of ETI by surveying the enhanced layout of our new website. The look and feel of the site are remarkable. You will find it an indispensable tool for learning about our premiere offerings.”
Redfern concluded, “Another step to enable our customers to build better boards, faster.”
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Nordson Electronics Solutions Develops Panel-level Packaging Solution for Powertech Technology, Inc. That Achieves Yields Greater Than 99% for Underfilling During Semiconductor Manufacturing
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