-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueVoices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
The Essential Guide to Surface Finishes
We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
It's Show Time!
In this month’s issue of PCB007 Magazine we reimagine the possibilities featuring stories all about IPC APEX EXPO 2025—covering what to look forward to, and what you don’t want to miss.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
Toyochem Develops Highly Flexible EMI Shielding Films for Smart Devices
June 9, 2023 | ToyochemEstimated reading time: 1 minute

Toyochem Co., Ltd., the polymer and coatings division of Japan’s Toyo Ink Group, has rolled out the new LIOTELAN line of highly flexible conductive and insulating sheet films for the protection of electrical and electronic equipment. The new sheet films exhibit high water-resistance and are highly flexible with a high elongation of 500 percent. LIOTELAN shielding films can be hot-press molded on to the electromagnetic interference (EMI) noise source on the printed circuit board (PCB), thus forming a lightweight multi-layer shield with a more compact format than a metal shielding can. The gives component engineers increased design freedom to create electronic devices of lower profiles and lighter weights – and without compromising shielding effectiveness. Potential applications are wearable devices, wireless communications and other smart devices.
Traditionally, metals are commonly adapted as EMI shields due to their shielding effectiveness. Looking to replace shielding metals, Toyochem engineers in Japan applied its own functional filler dispersion technology in the development of highly conductive fillers to improve EMI shielding performance. This development, and the application of Toyochem’s polymer sheet conversion technology, led to the creation of filler films that could be converted into flexible LIOTELAN sheet films with high shielding effect, water-resistance and mechanical durability.
Moreover, LIOTELAN sheets films are capable of fabricating multi-layer EMI shields by the hot-pressing method. “An insulating sheet layer can be hot-press molded directly over electronic components attached to the substrate. A conductive layer is formed over the insulating layer using the same method. With LIOTELAN shielding films, device engineers can easily and speedily create lightweight, durable and effective EMI shields, without the need for soldering or a bulky can cover,” explains Hidenobu Kobayashi, technical manager at Toyochem. “This new innovative product enables the formation of ultra-thin shielding laminates of high flexibility, conductivity and insulation properties required by next-generation PCBs. In line with rising demand for components of lighter weight, lower profiles, and more durable and flexible materials, we expect to see the trend towards metals being replaced by polymer composites to continue.”
The new LIOTELAN line of EMI shielding sheet films will be making its global debut at the Toyochem booth #1016 at the International Microwave Symposium in San Diego, California, from June 11–16, 2023. Toyochem will also feature its LIOELM™ TSS™ 500 series for next-generation high-speed communication devices among other high-performance materials designed to solve problems related to electromagnetic radiation and thermal conductivity.
Suggested Items
KOKI Expands U.S. Sales Coverage with Multiple New Representatives
04/29/2025 | KOKIKOKI, a global leader in advanced soldering materials and process optimization services, is pleased to announce the expansion of its U.S. sales network with the addition of three new manufacturers’ representative firms: Assembled Product Specialists, Diversitech Reps Inc., and Eagle Electronics.
SMTA Bridging the Skills Gap in Arizona
04/24/2025 | Marcy LaRont, I-Connect007One area where SMTA really excels is through its local chapters. On April 16, 2025, I-Connect007's Marcy LaRont attended the Workforce Breakfast during the SMTA Arizona Expo & Tech Forum in Mesa, which featured more than 50 electronics professionals from the local area, including defense OEMs, and others who were attending for the first time. Blackfox and Hyrel Technologies sponsored the event. The keynote presentation featured Sean Denny, a professor at Estrella Mountain Community College, who emphasized a clear need for skilled hand soldering technicians.
IPC Releases Version 2.0 of IPC-2591, Connected Factory Exchange, with Expanded Device Coverage and Smarter Data
04/23/2025 | IPCIPC announces the release of IPC-2591, Connected Factory Exchange (CFX), Version 2.0, the global standard for plug-and-play, machine-to-machine, and machine-to-system communication for digital manufacturing.
Indium Experts to Present on Power Electronics at PCIM Europe 2025
04/17/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly and e-Mobility industries, Indium Corporation experts will share their technical insight and knowledge on a variety of industry-related topics throughout PCIM Europe, May 6-8, in Nuremberg, Germany.
KOKI Announces Upcoming Webinar on Solder Voiding – Causes and Remedies
04/16/2025 | KOKIKOKI, a global leader in advanced soldering materials and process optimization services, is pleased to announce its upcoming webinar, “Solder Voiding—Causes and Remedies,” which will take place on Tuesday, April 22, 2025, at 12:00 PM CDT. Jerome McIntyre, Regional Sales & Applications Engineer at KOKI Americas, will present this live session.