-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueIt's Show Time!
In this month’s issue of PCB007 Magazine we reimagine the possibilities featuring stories all about IPC APEX EXPO 2025—covering what to look forward to, and what you don’t want to miss.
Fueling the Workforce Pipeline
We take a hard look at fueling the workforce pipeline, specifically at the early introduction of manufacturing concepts and business to young people in this issue of PCB007 Magazine.
Inner Layer Precision & Yields
In this issue, we examine the critical nature of building precisions into your inner layers and assessing their pass/fail status as early as possible. Whether it’s using automation to cut down on handling issues, identifying defects earlier, or replacing an old line...
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
SigmaSense Announces Technology Licensing and Co-development with NXP Semiconductors
May 17, 2023 | Business WireEstimated reading time: 1 minute

SigmaSense announced a license and co-development with NXP Semiconductors to lead in the transition from traditional touch interfaces to multi-dimensional sensing capable of revolutionizing user experiences. SigmaSense has licensed technology to NXP, and the companies will collaborate on high-performance sensing products for specific applications with demands for faster, more robust, fully immersive software-defined experiences.
“The next generation of smart devices and applications are demanding data for enhanced functionality that requires an entirely new software-programmable approach to sensing,” said Lars Reger, CTO, NXP Semiconductors. “SigmaSense created a breakthrough in sensing technology with an innovative approach that makes exciting new product designs possible. We are thrilled to team with SigmaSense to productize a new era of NXP solutions.”
“NXP’s prowess in highly dependable products and deep expertise in high-volume semiconductor design combined with SigmaSense technology will accelerate game-changing sensing products,” said Rick Seger, CEO, SigmaSense. “Our co-development with NXP marks the transition to a universe of new data-centric design options driven by software-defined sensing.”
SigmaSense innovations make it possible to extract vastly more data from the physical world for a wide range of products and systems. Multi-dimensional sensing works through many different surfaces, shapes, and materials, enabling previously impossible designs. With the invention of measuring current direct-to-digital, SigmaSense delivers low-voltage, frequency domain sensing, an industry first. Fast, continuous, high-fidelity data capture with intelligent digital signal processing moves analog challenges to the digital domain, where design flexibility can deliver orders of magnitude improvement. SigmaSense is changing system designs from foldable displays to EV batteries.
Suggested Items
Transition Automation Receives Multiple Large-Format Permalex Squeegee Orders from Top Space Technology Customer
02/24/2025 | Transition AutomationTransition Automation, Inc. (TA) has qualified to supply a top tier Space and Satellite Technology provider’s SMT Printing Process through multiple large-format orders for Permalex Edge Universal Holder and Blade systems with Soft-Touch Paste Retainers.
Samsung Display Partners with Intel to Target Next-Gen AI PC Market
02/24/2025 | Samsung Display CompanySamsung Display has signed a Memorandum of Understanding (MoU) with Intel®, a global semiconductor company, showing both companies’ intent to cooperate in the development of next-generation IT technology and joint marketing efforts.
Jaltek Design Shortlisted for The Engineer’s Collaborate to Innovate Awards
02/24/2025 | JaltekJaltek Design are delighted to have been shortlisted for The Engineer’s Collaborate to Innovate Awards. Now in its ninth year, Collaborate to Innovate (C2I) was launched to uncover and celebrate great examples of engineering collaboration – a dynamic considered critical to solving many of the challenges and problems faced by society.
Registration Open for Electrical Wire Processing Technology Expo (EWPTE) 2025
02/24/2025 | IPCRegistration is now open for the Electrical Wire Processing Technology Expo (EWPTE), to be held at Baird Center May 6-8, 2025, in Milwaukee, Wisconsin.
Hon Hai Research Institute Achieves Quantum Computing Breakthrough at QIP 2025
02/24/2025 | Hon Hai Technology GroupHon Hai Technology Group, the world’s largest technology manufacturing and service provider, has announced another advancement in its forward-looking technology research and development at the Hon Hai Research Institute.