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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Incap Romania Expands Cable Assembly Capacity for Electric Bus Project

10/01/2026 | Incap
Incap Electronics Romania has made an investment in a new semi-automatic cable assembly processing system to support a recently awarded multi-year electric bus project with an estimated annual value of EUR 5 million.

North American EMS Orders Outpace Shipments in August as Bookings Rise 53.5% Year-Over-Year

10/01/2026 | Global Electronics Association
The Global Electronics Association announced today the August 2026 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.39.

North American PCB Shipments Jump 23.5% in August, Extending Strong 2026 Growth

10/01/2026 | Global Electronics Association
The Global Electronics Association announced the August 2026 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.29.

2026 Charles Hutchins Educational Grant Winner Announced

10/01/2026 | SMTA
 SMTA is honored to announce Waad Q. Tarman, a Ph.D. candidate from Auburn University, has been selected as the winner of the 2026 Charles Hutchins Educational Grant.

October SMT007 Magazine Examines Automotive Soldering Reliability

10/01/2026 | I-Connect007 Editorial Team
The October 2026 issue of SMT007 Magazine is now available. As automakers add more electronics while maintaining high production volumes, the stakes for reliable electronics assembly continue to rise. Every added board, sensor, and control system must perform consistently under demanding conditions.
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