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Advanced Electronics Packaging Digest

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Electronics Hiring Is a Precision Problem

07/21/2026 | I-Connect007
Manufacturers across the electronics industry continue to report the same challenge: How do I find qualified people? At first glance, this appears to be a labor shortage, but the data reveals a more nuanced story. According to Deloitte and The Manufacturing Institute, the U.S. manufacturing sector will need approximately 3.8 million new workers between 2024 and 2033. Without significant improvements in workforce development and recruitment, an estimated 1.9 million of those positions could go unfilled.

The Right Approach: The Pros and Cons of PCB Vertical Integration

07/21/2026 | Steve Williams -- Column: The Right Approach
Vertical integration in PCB fabrication is a genuinely contested strategic question with real tradeoffs on both sides. The core tension: Fabricators integrate up into design and down into assembly to gain margin and stickiness, but risk diluting their manufacturing focus and alienating the EMS and design-house partners they depend on.

It’s Only Common Sense: The Underrated Business Strategy of Joy

07/06/2026 | Dan Beaulieu -- Column: It's Only Common Sense
Somewhere along the way, businesses have become far too serious for its own good. We’ve started believing that exhaustion is proof of commitment, being stressed means importance, and that the more pressure we feel, the more productive we are. Entire workplaces have slowly lost their sense of fun, creativity, and humanity because our leaders became convinced that joy somehow distracts from performance instead of fueling it. I think that is one of the biggest mistakes modern companies make.

Transforming PCB Design from Reactive to Predictive With Digital Twins

07/01/2026 | Stephen V. Chavez, Siemens EDA and PCEA
For decades, PCB development has largely followed a sequential process. Design teams create the schematic, develop the layout, fabricate prototypes, perform validation testing, identify problems, revise the design, and repeat the cycle until the product eventually meets specifications. While this approach has historically been accepted as normal, it is increasingly incompatible with modern product demands, where development speed, quality, and predictability define competitive advantage.

Nokia Announces Major Expansion of U.S. Semiconductor Advanced Test and Packaging in Pennsylvania to Bolster AI Growth

06/24/2026 | Nokia
Nokia announced a major expansion of its advanced test and packaging (ATP) operations in Allentown, Pennsylvania. The investment will increase domestic production capacity of the optical networking technologies that power scalable AI infrastructure connectivity across the United States.
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