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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
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TRI Releases New Multi-Camera 3D AOI
May 5, 2022 | TRIEstimated reading time: Less than a minute

Test Research, Inc. (TRI) proudly announces the launch of the Multi-Camera 3D Side View AOI solution, TR7500QE Plus, performing at industry-leading speeds of up to 57 cm2/sec.
The metrology-grade 3D AOI, TR7500QE Plus, is built on an enhanced mechanical platform to guarantee inspection stability, accuracy, and precision. The TR7500QE Plus is the next-generation Multi-camera side view 3D AOI equipped with innovative AI-powered algorithms and increased mechanical capabilities.
The Multiple-camera AOI system includes four side-view cameras for the front, rear, left, and right viewing angles and the views from the top camera. Multiple viewing angles minimize human mistakes by detecting concealed defects usually concealed from the top-camera view. The Side View cameras allow the platform to inspect inner layer bridges, hidden lifted leads and other out of sight defects.
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