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Lockheed Martin Demonstrates New Layered Missile Defense Integration for U.S. Army
March 29, 2022 | Lockheed MartinEstimated reading time: 1 minute
Lockheed Martin, the Missile Defense Agency (MDA) and the U.S. Army successfully further integrated the PAC-3 Missile Segment Enhancement (MSE) interceptor into the Terminal High Altitude Area Defense (THAAD) Weapon System – resulting in a more tightly integrated, layered missile defense system.
During a test, the THAAD system successfully launched a PAC-3 MSE to intercept a tactical ballistic missile target using proven Hit-to-Kill technology without the support of a Patriot fire unit, yielding greater flexibility for the warfighter. Integration into the THAAD Weapon System allows the PAC-3 MSE to launch earlier, enabling a longer flyout and the full use of the MSE’s kinematic capability.
“This integration is another Lockheed Martin contribution to joint all-domain operations and offers a critical capability in 21st century security that gives the warfighter more options with existing equipment so they can choose the best interceptor for any threat they face,” said Scott Arnold, vice president, Integrated Air & Missile Defense at Lockheed Martin Missiles and Fire Control.
The test also validates the flexibility of our PAC-3 missiles, which have now successfully launched from THAAD, Patriot and the U.S. Army’s Integrated Air and Missile Defense Battle Command System (IBCS) in flight tests.
Several flight tests led to today’s integration of PAC-3 MSE within THAAD. In a 2020 flight test, a PAC-3 MSE intercepted a target using data provided by THAAD. In an earlier test this year, the THAAD Weapon System launched a PAC-3 MSE interceptor against a virtual threat, demonstrating the successful integration of the PAC-3 MSE interceptor into the THAAD system.
THAAD is the only U.S. system designed for endo-and exo-battlespace, using Hit-to-Kill technology to execute its lethal aim-point accuracy to intercept a threat with direct impact.
PAC-3 MSE is an evolution of the battle-proven PAC-3 Cost Reduction Initiative (CRI) and also uses Hit-to-Kill technology to defend against threats through direct body-to-body contact that delivers exponentially more kinetic energy on the target than can be achieved with blast-fragmentation mechanisms.
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Analog Devices Launches ADI Power Studio™ and New Web-Based Tools
10/14/2025 | Analog Devices, Inc.Analog Devices, Inc., a global semiconductor leader, announced the launch of ADI Power Studio, a comprehensive family of products that offers advanced modeling, component recommendations and efficiency analysis with simulation. In addition, ADI is introducing early versions of two new web-based tools with a modernized user experience under the Power Studio umbrella:
Beyond Thermal Conductivity: Exploring Polymer-based TIM Strategies for High-power-density Electronics
10/13/2025 | Padmanabha Shakthivelu and Nico Bruijnis, MacDermid Alpha Electronics SolutionsAs power density and thermal loads continue to increase, effective thermal management becomes increasingly important. Rapid and efficient heat transfer from power semiconductor chip packages is essential for achieving optimal performance and ensuring long-term reliability of temperature-sensitive components. This is particularly crucial in power systems that support advanced applications such as green energy generation, electric vehicles, aerospace, and defense, along with high-speed computing for data centers and artificial intelligence (AI).
Bluepath Robotics Optimizes AMR Fleets with Inductive Charging Solution from Wiferion
10/09/2025 | WiferionIn a dynamic and highly competitive industry such as logistics, efficient and uninterrupted material flows are of crucial importance. To ensure maximum uptime for its robots, Bluepath Robotics, which specializes in autonomous mobile robots (AMR), needed a reliable and powerful power supply.
‘Create your Connections’ – Rehm at productronica 2025 in Munich
10/08/2025 | Rehm Thermal SystemsThe electronics industry is undergoing dynamic transformation: smart production lines, sustainability, artificial intelligence, and sensor technologies dominate current discussions.
ESD Alliance Reports Electronic System Design Industry Posts $5.1 Billion in Revenue in Q2 2025
10/06/2025 | SEMIElectronic System Design (ESD) industry revenue increased 8.6% to $5,089.4 million in the second quarter of 2025 from the $4,685.5 million registered in the second quarter of 2024, the ESD Alliance, a SEMI Technology Community, announced in its latest Electronic Design Market Data (EDMD) report.