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L3Harris Completes Imager Integration for NOAA’s Advanced Environmental Satellite
February 21, 2022 | Business WireEstimated reading time: Less than a minute

The fourth Advanced Baseline Imager (ABI) built by L3Harris Technologies has been successfully integrated into NOAA’s Geostationary Operational Environmental Satellite-U (GOES-U), completing the series of advanced weather sensors for the GOES program, slated to launch in 2024.
The ABIs onboard the GOES series of satellites provide revolutionary technology by advancing weather observation and environmental monitoring services, and also by providing more advanced notice of fires, hurricanes, tornadoes and floods. The ABI provides high-resolution video of weather and environmental systems using 16 spectral bands delivering three times the amount of spectral coverage, four times the resolution and five times faster than the previous generation of GOES satellites.
For nearly 60 years, L3Harris has developed breakthrough technology and launched innovative solutions that further improve the accuracy of weather forecasts, measure climate change and increase life-saving warning times.
The third ABI is onboard NOAA’s GOES-T satellite, scheduled to launch March 1, 2022. GOES satellites are under command and control of the L3Harris-built enterprise ground system.
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Brent Fischthal - Koh YoungSuggested Items
NEDME Returns October 22 — The Northwest’s Premier Design & Manufacturing Expo
10/13/2025 | NEDMEThe Northwest Electronics Design & Manufacturing Expo (NEDME) returns on Wednesday, October 22, 2025, at Wingspan Event & Conference Center, Hillsboro. The event brings together engineers, product designers, manufacturers, educators, and community partners for a full day of industry connection, learning, and networking.
Interposers, Substrates, and Advanced Manufacturing
10/13/2025 | Marcy LaRont, I-Connect007I attend a lot of industry trade shows and conferences. Lately, during conversations with technologists, I’ve noticed that there is some confusion about what exactly constitutes an interposer. One question I hear every so often is, “Are all interposers substrates?” The short answer to that question is no. But some interposers are, in fact, full substrates.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
10/10/2025 | Nolan Johnson, I-Connect007I-Connect007 has a new monthly digest newsletter, the Advanced Electronic Packaging Digest, and as I was scanning our advanced packaging newsfeeds this week, I came across a primer from tokenring.ai (republished through station WRAL, Raleigh, North Carolina), which I found quite useful. Whether you’re a designer, fabricator, or assembler, the package schemes being developed will change how you work, so be sure to keep your eye on the technological horizon and subscribe to the monthly Advanced Electronic Packaging Digest.
The Latest Issue: Advanced Electronics Packaging Digest to Explore Critical Minerals, Substrates, and Reliability Standards Driving Next-Gen Electronics
10/09/2025 | I-Connect007I-Connect007 is pleased to announce the upcoming issue of Advanced Electronics Packaging Digest (AEPD) on October 13, 2025, featuring expert insights on the technologies shaping the future of advanced packaging. As the electronics industry evolves, this issue takes a closer look at the materials, designs, and standards redefining performance and reliability across global markets.
Advanced Rework Technology Inspires Students at National Manufacturing Day 2025
10/08/2025 | A.R.T. Ltd.Advanced Rework Technology Ltd. (A.R.T.), a leading independent IPC-accredited training provider, joined forces with Jaltek, a UK-based electronics manufacturer with over 35 years’ experience in designing and producing high-quality electronic products, to deliver hands-on workshops for students during National Manufacturing Day 2025.