Flexible Thinking: The Key to a Successful Flex Circuit Design Transfer
Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4
Real Time with... IPC APEX EXPO 2022: Smart Factories Demand Total Inspection
February 8, 2022 | Real Time with...IPC APEX EXPOEstimated reading time: Less than a minute
Joel Scutchfield of Koh Young America and SMT007 Editor Nolon Johnson discuss the smart factory's need for a total inspection solution that includes SPI, AOI, DPI, API, and KSMART, along with multi-point inspection (SPI, pre, and post) to improve yields. As Scutchfield points out, "Connectivity alone does not equal a smart factory. It's what you do with the data."
If you were unable to attend IPC APEX EXPO, don't worry. We're bringing you coverage of the week's events in San Diego, from ribbon cutting to teardown.
Watch this interview below or click here to view on our show page.
Check out this additional content from Koh Young:
- The Printed Circuit Assembler’s Guide to… SMT Inspection: Today, Tomorrow, and Beyond by Brent Fischthal (a free eBook available for download)
- “Converting Process Data Into Intelligence” by Joel Scutchfield and Ivan Aduna, a free 12-part micro webinar series
- You can also view other titles in our full I-007e Book library here
Share on:
Suggested Items
Real Time with... IPC APEX EXPO 2025: Technological Advancements – IPC's Vision for 2025
04/16/2025 | Real Time with...IPC APEX EXPONolan Johnson introduces Matt Kelly, the CTO and VP Standards & Technology at IPC, who shares insights on recent organizational changes. He highlights the importance of proactive standards development to match the rapid pace of technology, predicting a tenfold acceleration in advancements over the next five years. IPC's core initiatives for 2025 focus on design, advanced electronics packaging, and digital manufacturing, aiming to create new guidelines and standards that meet industry demands.
IPC President’s Award: Dr. Thomas Marktscheffel
04/15/2025 | Nolan Johnson, I-Connect007At ASMPT SMT Solutions, Thomas Marktscheffel, director of product management software solutions, is responsible for the SMT line software portfolio. As a member and leader of several IPC committees, he is also a driving force for global industry standards such as IPC-2591 CFX and IPC-HERMES-9852, which make it possible to provide plug-and-play connectivity for intelligent SMT Factories. In 2015, he participated in the IPC-1782 A-team and subsequently joined the IPC-2591 CFX standard A-team, which became the new SMT industry communication standard following its first release in March 2019.
BEST Inc to Host Soldering 101 Workshop at Illinois & Michigan Locations
04/15/2025 | BEST Inc.BEST Inc., a leader in electronic component services, training, and products is pleased to announce it will host multiple Soldering 101 workshops in its Rolling Meadows, Illinois and Lansing, Michigan locations.
Explore TRI's Test and Inspection Innovations at ElectroneX
04/15/2025 | TRIGPC Electronics, TRI's industry partner, will participate in the ElectroneX Electronics Design & Assembly Expo 2025 at the Melbourne Convention & Exhibition Centre, Australia, on May 7–8, 2025.
HT Pho-Tronics Appoints Ankit B. Goti as New General Manager to Drive Strategic Growth
04/14/2025 | HT Pho-TronicsHT Pho-Tronics, a leading provider of high-reliability printed circuit boards (PCBs), proudly announces the appointment of Ankit B. Goti as the company’s new General Manager, effective immediately.
Copyright © 2025 I-Connect007 | IPC Publishing Group Inc. All rights reserved.
Log in