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For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
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Z-AXIS Benefits from AAT's HydroJet In-line Cleaning System
February 3, 2022 | Z-AXISEstimated reading time: 1 minute

Z-AXIS, Inc. utilizes the HydroJet® In-line cleaning system from Austin American Technology to clean under tightly spaced components at its ISO 9001:2015 certified design and manufacturing facility. Z-AXIS provides quality design, prototyping and manufacturing services for complex electronic products and electromechanical assemblies.
Z-AXIS continually invests in the latest equipment and skills for printed circuit board assembly, from through-hole to the smallest surface mount technology (SMT). Last year, the company more than doubled its capacity for over-molding strain relief onto the custom wire and cable assemblies that it manufactures for customers throughout the USA.
Over the past year, Z-AXIS has utilized the HydroJet to clean under tightly spaced components. The HydroJet was the first In-line cleaner to introduce the current standard of coherent jet technology. AAT further improved this technology by developing Progressive Energy Dynamics (PED), which is only available on Austin American In-line Cleaners.
“We considered all of the washers on the market and found the AAT design, technology and machine size to be the best for our fine-pitch, large verity, complex circuit board assemblies,” said Michael Allen, President of Z-AXIS Inc. “Their communication and installation team after the sale was A+ service. Clearly way above norm these days.”
The HydroJet features an integrated closed-loop system. During its lifetime, the cleaner will enable Z-AXIS to save thousands of gallons of water and kilowatts of power. Additionally, the in-line cleaner is equipped with a patented displacement drying system that minimizes energy consumption and ionic residues left on boards and provides the fastest drying performance available.
Z-AXIS has a long history of custom electronics design and high-quality manufacturing for commercial, medical, military and industrial customers. The company offers fast design turnaround, competitive NRE charges, rapid production and low freight costs from its modern 32,000 square foot electronic design and contract manufacturing center in Rochester, NY.
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Review: PCEA Orange County Summer Meeting
08/06/2025 | Dan Feinberg, Technology Editor, I-Connect007The Printed Circuit Engineering Association (PCEA) represents a community of engineers, designers, and industry influencers dedicated to the advancement of PCB technology, design, and manufacturing, and the growth and knowledge of its membership. PCEA regularly hosts events to share the latest developments, best practices, and visions for the future of electronic design and manufacturing. The Orange County chapter seems to be one of the largest and most active ones and I was invited to attend the latest chapter event on July 24 in Costa Mesa, California.
Benchmark Announces Appointment of Chuck Swoboda to Board of Directors
08/05/2025 | Benchmark Electronics Inc.Benchmark Electronics, Inc., a global provider of engineering, design, and manufacturing services, announced the appointment of Charles “Chuck” Swoboda to its Board of Directors.
Federal Electronics Marks 10th Year of ISO 13485 Certification with Successful 2025 Surveillance Audit
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Report: Green Electronics Market to Hit $46.53B by 2029
08/05/2025 | Globe NewswireAccording to the Green Electronics Manufacturing Market Report 2025, this sector will grow from $16.81 billion in 2024 to $20.66 billion in 2025 at a compound annual growth rate (CAGR) of 22.9%.
Advancing Electrolytic Copper Plating for AI-driven Package Substrates
08/05/2025 | Dirk Ruess and Mustafa Oezkoek, MKS’ AtotechThe rise of artificial intelligence (AI) applications has become a pivotal force driving growth in the server industry. Its challenging requirements for high-frequency and high-density computing are leading to an increasing demand for development of advanced manufacturing methods of package substrates with finer features, higher hole densities, and denser interconnects. These requirements are essential for modern multilayer board (MLB) designs, which play a critical role in AI hardware. However, these intricate designs introduce considerable manufacturing complexities.