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Cirexx Adds to Excellon Cobra Laser Fleet
January 31, 2022 | ExcellonEstimated reading time: Less than a minute

Cirexx International has acquired and installed a fifth Excellon Cobra laser machine. The hybrid Laser and is equipped with both CO2 and UV laser technology. It is designed to “drill” holes, “rout” profiles and micro-machine fine features in printed circuit boards and specifically flex circuits. The machine comes with the upgraded controller, latest software, High Speed Intelligent Scanners and variable power high pulse energy lasers.
Mike Sparidaens of Excellon said, “Cirexx is realizing the benefits from the enhanced technology of this next generation Cobra-II laser. As our product evolves, we look forward to continue being part of Cirexx's technology roadmap for many years to come.”
Philipp Menges, Cirexx President/CEO commented, “We began using the COBRA lasers to make fine and very accurate features in flex circuits, but we are using them more and more these days to make micro vias in HDI boards. The quality and reliability of Excellon machines means to me that they will be running like workhorses without downtime. Add the outstanding Excellon service that we receive from Mike and his team, and we have a true win-win.”
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Klaus Koziol - atgSuggested Items
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UHDI Fundamentals: UHDI Technology and Industry 4.0
09/03/2025 | Anaya Vardya, American Standard CircuitsUltra high density interconnect (UHDI) technology is rapidly transforming how smart systems are designed and deployed in the context of Industry 4.0. With its capacity to support highly miniaturized, high-performance, and densely packed electronics, UHDI is a critical enabler of the smart, connected, and automated industrial future. Here, I’ll explore the synergy between UHDI and Industry 4.0 technologies, highlighting applications, benefits, and future directions.
CEE PCB Launches PCBpedia: A New Knowledge Hub for Circuit Board Technology
09/03/2025 | CEE PCBCEE PCB, a leading manufacturer of PCBs and FPCs, is responding to the growing demand for reliable technical knowledge. With PCBpedia, CEE introduces a new knowledge platform featuring expert articles on key topics in circuit board technology – from FPC design rules to surface finishes.
Coming Soon: The Advanced Electronics Packaging Digest
08/27/2025 | Marcy LaRont, I-Connect007The upcoming Advanced Electronics Packaging Digest is a curated, condensed monthly publication designed to keep you informed and engaged with the fast-moving world of advanced electronics packaging (AEP). In our inaugural September issue, we will begin at the foundation with an in-depth interview featuring Matt Kelly, CTO of the Global Electronics Association. Kelly and his Technology Solutions Team approach advanced packaging from a holistic systems perspective.
Nordson Reports Q3 Fiscal 2025 Results and Updates Full Year Guidance
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