American Made Advocacy: Reshoring—About Trust, Not Just Geography
Defense Speak Interpreted: It’s Time for a ‘Defense-Speak’ Update
Beyond the Board: The Future of Innovation—Why the Electronics Industry Needs You
Call-for-Participation Webinar: iNEMI Electromigration of SnBi Solder for Second-Level Interconnect Project
January 7, 2022 | iNEMIEstimated reading time: 1 minute
The low melting temperature of SnBi alloys (138°C) makes them attractive for assembling thermally warpage-prone high-density microelectronic packaging. However, Bi has a high propensity for electromigration and segregation at the anode under high current density conditions. This can lead to potentially brittle solder joints with high electrical resistance over time in the field. There is a need to mitigate this shortcoming and develop SnBi solder joints that maintain their performance and reliability over the product life. This iNEMI project will explore the potential to reduce electromigration in low-height solder joints by taking advantage of mechanical and/or chemical back stresses.
Objective
The overall project objective is to determine the boundaries of the envelope formed by joint height, temperature, current density and PCB finishes within which the solder joint will operate reliably over the product life.
The project has multiple phases planned. The first phase will:
- Establish an appropriate test vehicle for electromigration study of solder joints, including a convenient means of achieving various joint heights.
- Investigate the role of back pressure in reducing electromigration in eutectic SnBi solder joints by determining the rate of electromigration of SnBi solder joints with and without diffusion barriers as a function of current density, temperature and joint height.
The Electromigration of SnBi Solder for Second-Level Interconnect project is open for sign-up until January 31, 2022. Two call-for-participation webinar sessions are scheduled to introduce the project. These webinars are open to industry; advance registration is required.
Registration
Tuesday, January 11, 2022
10:00-11:00 a.m. EST (Americas)
3:00-4:00 p.m. CET (Europe)
11:00-12:00 p.m. CST (China)
Register for this webinar
Thursday, January 13, 2022
9:00-10:00 a.m. CST (China)
8:00-9:00 p.m. EST (Americas) on January 12
Register for this webinar
Share on:
Suggested Items
KYZEN to Highlight Stencil and Cleaning Solutions at SMTA Monterrey
03/27/2025 | KYZEN'KYZEN, the global leader in innovative environmentally friendly cleaning chemistries, will exhibit at the SMTA Monterrey Expo & Tech Forum scheduled to take place on Thursday, April 10 at the Cintermex Convention Center in Monterrey, Nuevo León. KYZEN cleaning experts will be on-site highlighting stencil cleaning chemistries KYZEN E5631J and CYBERSOLV C8882.
Indium to Showcase Proven EV Products and High-Reliability Alloys at Productronica China
03/26/2025 | Indium CorporationAs a global materials supplier and trusted partner in electric vehicle (EV) and e-Mobility manufacturing, Indium Corporation® is proud to showcase its high-reliability alloys and soldering solutions at Productronica China, March 26-28, in Shanghai, China.
SolderKing Enhances Brainboxes' Electronics Manufacturing with Expert Support and Advanced Materials
03/26/2025 | SolderKingIn modern electronics manufacturing, success relies on more than high-quality soldering materials. Technical knowledge and process expertise are just as crucial for achieving consistent results. SolderKing, a leading UK manufacturer, provides both, combining advanced consumables with specialist support to help manufacturers optimise their soldering processes.
AIM to Highlight Type 5 Solder and Other Leading Products at SMTA Monterrey Expo & Tech Forum
03/20/2025 | AIM SolderAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Monterrey Expo & Tech Forum taking place on April 10 at Cintermex in Monterrey, Nuevo Leon, Mexico.
Hentec Industries/RPS Automation to Showcase Valence 2508 at IPC Expo 2025
03/17/2025 | Hentec Industries/RPS AutomationThe Valence 2508 Selective Soldering System is engineered for high-mix, high-volume, advanced PCB production. It supports boards ranging from 25 x 25 mm to 559 x 559 mm (1 x 1 in. to 22 x 22 in.), with a maximum processing area of 508 x 508 mm (20 x 20 in.).