It’s Only Common Sense: Stop Chasing New Customers and Start Keeping the Ones You Have
Driving Innovation: Inner Layer Alignment Methods in PCB Production
Trouble in Your Tank: Metallizing Flexible Circuit Materials—Mitigating Deposit Stress
Atotech, AT&S Announce Project to Optimize Energy Efficiency and Meet Climate Goals
October 20, 2021 | AtotechEstimated reading time: 1 minute
Atotech and AT&S have announced a joint collaboration project with the goal of reducing energy consumption and optimizing energy efficiency of the AT&S production processes in the plating lines manufactured by Atotech.
AT&S and Atotech are leaders in their respective fields from a sustainability perspective. AT&S is committed to active change leadership with ambitious climate targets, specifically regarding annual reductions of their carbon footprint and use of freshwater, by 5% and 3%, respectively. Atotech has been at the forefront of delivering sustainable products for decades, with systems designed to reduce the use of raw materials, energy, and water for our customers.
Building on Atotech’s long-standing commitment to innovation and sustainability, the company recently expanded its internal competency to the development of industrial software solutions, including Industrial Internet of Things (IIOT) applications. As part of the collaboration with AT&S, Atotech will provide an innovative combination of IIOT software solutions and hardware optimization which will enable AT&S to reduce overall energy consumption and help them to meet their climate goals.
“This collaboration is a natural product of our companies’ common strengths and objectives. It is an excellent example of our commitment to making a positive difference for our communities and the environment at large,” said Geoff Wild, CEO of Atotech. “Atotech is the only major surface-finishing solutions company to provide chemistry, equipment, software and service in a comprehensive solutions-based package,” Mr. Wild continued, “We are delighted to be able to provide that full spectrum of solutions to AT&S.”
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
MKS’ Atotech to Participate in IPCA Electronics Expo 2025
08/11/2025 | AtotechMKS Inc., a global provider of enabling technologies that transform our world, announced that its strategic brands ESI® (laser systems) and Atotech® (process chemicals, equipment, software, and services) will showcase their latest range of leading manufacturing solutions for printed circuit board (PCB) and package substrate manufacturing at the upcoming 17th IPCA Show to be held at Pragati Maidan, New Delhi from August 21-23, 2025.
EMC-Taiwan Announces Further Investment in North America
08/11/2025 | Elite Material Co. LtdElite Material Company (EMC)-Taiwan announced that it has made a commitment to invest $80 million dollars in the Arlon EMD factory in Rancho Cucamonga, CA it acquired at the end of 2020.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
08/08/2025 | Andy Shaughnessy, I-Connect007If you’ve been watching the news lately, you might be tempted to opine, “What’s going on here?” In this week’s must-reads, we have a wrap-up of the latest news about U.S. tariffs with Asia, and columnist Tom Yang explains why some PCB fabrication business should remain in China. We also have a piece that examines the unprecedented growth that green manufacturing is expected to see over the next four years.
Materials and Manufacturing for the AI Era: The Next PCB Frontier
08/08/2025 | Edy Yu, Chief Editor, ECIO, and the I-Connect007 Editorial TeamAI is pushing hardware to its limits, and the bottleneck isn’t design anymore—it’s materials. Next-generation AI servers aren’t just heavier on layer counts. They demand better materials to handle the speed, heat, and signal integrity requirements of 400G, 800G, and even 1.6T Ethernet systems. Many server motherboards are already 32–36 layers. For the next wave of 1.6T-capable boards, expect 40–50 layers, which must maintain high-frequency performance without degrading signal quality.
Nvidia’s PCB Vendor Victory Giant Plans to Raise Funds in Hong Kong IPO
08/07/2025 | I-Connect007 Editorial TeamNvidia supplier Victory Giant Technology, based in Huizhou, Guangdong, China, released plans at the end of July for a Hong Kong share offering. The move came after regulators eased fundraising rules to support high-tech companies, the South China Morning Post reported.