Share on:

Share on LinkedIn Share on X Share on Facebook Share with email


Advanced Electronics Packaging Digest

Subscribe

Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

Subscribe now to stay informed, competitive, and connected.

Suggested Items

CTS Corporation Names COO Pratik Trivedi CEO and President

06/29/2026 | Globe Newswire
CTS Corporation announced that its Board of Directors has promoted Pratik Trivedi, CTS’ current COO, to Chief Executive Officer and President effective July 6, 2026.

RBB Welcomes Shawn Myers as Engineering Project Manager

06/29/2026 | RBB
RBB, a trusted leader in electronics manufacturing since 1973, RBB is pleased to announce the addition of Shawn Myers to its team as Engineering Project Manager.

Wistron Approves New Investments to Support Global Manufacturing Expansion

06/26/2026 | Wistron
Wistron Corporation announced that its Board of Directors convened a meeting and approved a series of capital expenditures and an additional capital injection to support its manufacturing and EMS operations.

Scanfil Advances Social Sustainability Across Own Workforce and Workers in the Value Chain

06/26/2026 | Scanfil
People and partnerships are at the core of Scanfil’s sustainability work. In 2025, Scanfil made measurable progress in advancing social sustainability within its own workforce and the workers in the value chain.

Scanfil Customer Survey Shows Strong Satisfaction, Record Engagement

06/25/2026 | Scanfil
Scanfil’s latest customer survey results show solid overall performance and continued high customer engagement across its global operations.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in