Flexible Thinking: Rules of Thumb—A Word to the Wise
Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4
Connect the Dots: Five Best Practices for Designing Flex and Rigid-flex PCBs
Ansys Receives TSMC OIP Ecosystem Forum Customers' Choice Award for 5G Millimeter Wave Chip Analysis Solution Paper
March 19, 2021 | PRNewswireEstimated reading time: 1 minute
Ansys received the Customers' Choice Award for a technical paper presented at TSMC 2020 North America Open Innovation Platform® (OIP) Ecosystem Forum. Within the paper, Ansys provided a roadmap for adding new technology to the Ansys® Totem™ RF design solution to address challenges in next-generation communication technologies beyond 5G, enabling customer success. The paper won the award based on the popular vote by conference attendees and can be downloaded on TSMC.com.
Transitioning to 5G millimeter wave wireless communication requires massive integration of RF components into digital SoCs (System-on-Chip). RF devices consume significant power and the resulting electromigration and self-heating challenges significantly impact the efficiency, cost and reliability of high-speed designs, which must be comprehensively addressed. Ansys enhanced Totem's capabilities to address the needs of 5G and high-speed RF designers.
Ansys' paper, titled "Electromigration and Self-Heat Analysis on RF Devices for mmWave Designs," details how Totem empowers 5G and high-speed RF designers to conduct electromigration and self-heat analysis. The Totem electromigration flow was demonstrated on an RF block using TSMC 16nm process technology and has been validated by TSMC.
"As a valued partner, Ansys provides leading design solutions that enable our mutual customers to take advantage of TSMC's latest process technologies," said Suk Lee, vice president of the Design Infrastructure Management Division at TSMC. "We are pleased to congratulate Ansys as the winner of this Customers' Choice Award and look forward to our continued collaboration with Ansys to address future complex challenges for designing next-generation silicon technologies."
"Together with TSMC, Ansys continues to help engineers overcome significant hurdles for designing 5G and high-speed RF chips," said John Lee, vice president and general manager at Ansys. "Receiving this prestigious award from TSMC for the second time in three years is a testament to the impact our industry-leading simulation solutions have made on the design community and we intend to deepen our collaboration with TSMC to solve more challenges in the near future."
Share on:
Suggested Items
PCB Layout Rules of Thumb for Consideration
11/25/2024 | Patrick Davis, Cadence Design SystemsJust because a “rule of thumb” is usually based on experience instead of precise facts doesn’t negate its value. For instance, when I told my kids that a good rule of thumb was not to back-talk to their mother, they discovered very quickly how accurate my advice was once they crossed that line. There are a lot of rules of thumb that we rely on daily, including those that apply to PCB design.
HPC Customer Engages Sondrel for High End Chip Design
11/25/2024 | SondrelSondrel, a leading provider of ultra-complex custom chips, has announced that it has started front end, RTL design and verification work on a high-performance computing (HPC) chip project for a major new customer.
Rules of Thumb for PCB Layout
11/21/2024 | Andy Shaughnessy, I-Connect007The dictionary defines a “rule of thumb” as “a broadly accurate guide or principle, based on experience or practice rather than theory.” Rules of thumb are often the foundation of a PCB designer’s thought process when tackling a layout. Ultimately, a product spec or design guideline will provide the detailed design guidance, but rules of thumb can help to provide the general guidance that will help to streamline the layout process and avoid design or manufacturing issues.
PCB Design Software Market Expected to Hit $9.2B by 2031
11/21/2024 | openPRThis report provides an overview of the PCB design software market, detailing key market drivers, challenges, technological advancements, regional dynamics, and future trends. With a projected compound annual growth rate (CAGR) of 13.4% from 2024 to 2031, the market is expected to grow from $3.9 billion in 2024 to $9.2 billion by 2031.
KYZEN to Spotlight KYZEN E5631, AQUANOX A4618 and Process Control at SMTA Silicon Valley Expo and Tech Forum
11/21/2024 | KYZEN'KYZEN, the global leader in innovative environmentally friendly cleaning chemistries, will exhibit at the SMTA Silicon Valley Expo & Tech Forum on Thursday, December 5, 2024 at the Fremont Marriott Silicon Valley in Fremont, CA.