UHDI Fundamentals: UHDI Bleeding-edge Entertainment Applications, Part 2
February 6, 2025 | Anaya Vardya, American Standard CircuitsEstimated reading time: Less than a minute

Ultra high density interconnect (UHDI) technology is revolutionizing bleeding-edge entertainment applications by enabling compact, high-performance devices that push the boundaries of immersion, interactivity, and realism. Part 2 focuses on how UHDI is advancing the entertainment industry, particularly gaming:
Virtual reality (VR) and Augmented Reality (AR) in Gaming Systems
VR and AR experiences demand high performance in compact devices. UHDI supports:
- Miniaturized optics and display controllers: Facilitating lightweight, ergonomic headsets.
- High-speed processing for low latency: Essential for seamless motion tracking and real-time rendering.
- Integrated sensors and cameras: Enabling depth perception, spatial tracking, and hand gestures.
- Wireless modules for untethered use: Compact UHDI-based circuits enable high-speed, low-latency communication.
Gaming consoles and PCs are leveraging UHDI to deliver cutting-edge performance:
- Integrated GPUs and CPUs: High-density circuits for real-time ray tracing and AI-driven graphics.
- Compact cooling systems: UHDI designs support high-performance hardware in slimmer devices.
- High-speed interfaces: Supports ultra-fast storage and data transfer for seamless gameplay.
- Portable gaming devices: Miniaturized UHDI designs make powerful handheld systems possible.
To continue reading this article, which originally appeared in the January 2025 issue of Design007 Magazine, click here.
Suggested Items
Real Time with... IPC APEX EXPO 2025: Emerging Trends in Design and Technology
04/16/2025 | Real Time with...IPC APEX EXPOAndy Shaughnessy speaks with IPC design instructor Kris Moyer to discuss emerging design trends. They cover UHDI technology, 3D printing, and optical data transmission, emphasizing the importance of a skilled workforce. The role of AI in design is highlighted, along with the need for understanding physics and mechanics as designs become more complex. The conversation concludes with a focus on enhancing math skills for better signal integrity.
Real Time with... IPC APEX EXPO 2025: Insights into PCB Design and Manufacturing with Polar Instruments
04/03/2025 | Real Time with...IPC APEX EXPOErik Bateham discusses Polar's latest book, which enhances insights for PCB designers and manufacturers. The book, "The Designer's Guide to... More Secrets of High-Speed PCBs," features a guest chapter on 2D via design modeling. Erik highlights the industry's shift towards UHDI and the challenges in measuring at micron levels.
Electroninks' MOD and iSAP Game Changers
03/25/2025 | Marcy LaRont, PCB007 MagazineElectroninks, a prominent player in particle-free conductive inks, recently announced an exciting new range of metal-complex inks for ultra high density interconnect (UHDI) technology. At the SMTA UHDI Symposium in January, Mike Vinson, COO of Electroninks, gave a presentation on this line of MOD inks, which are versatile and suitable for a range of applications that require ultra-dense, miniaturized, and high-frequency technology. Mike says his technology is a game changer and will revolutionize UHDI circuit fabrication.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
03/07/2025 | Andy Shaughnessy, I-Connect007It’s been a busy week. My must-reads include articles and news items on global trends and challenges, groundbreaking technology, the hunt for the elusive young PCB designers, and some personnel changes. We also have a great column on the value of following up and keeping promises. We’re all guilty of “dropping the ball” from time to time, aren’t we?
Are Domestic Assemblers Ready for the Next Level of Electronics Miniaturization?
02/19/2025 | Chrys Shea, SHEA Engineering ServicesUHDI technology is more than another evolutionary level of miniaturization. It’s a fundamental change in how we create circuit boards, on a scale potentially as impactful as the transition from through-hole to surface mount was 40 years ago.
Copyright © 2025 I-Connect007 | IPC Publishing Group Inc. All rights reserved.
Log in