Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

07/18/2025 | Nolan Johnson, I-Connect007
It may be the middle of the summer, but the news doesn’t quit, and there’s plenty to talk about this week, whether you’re talking technical or on a global scale. When I have to choose six items instead of my regular five, you know it’s good. I start by highlighting my interview with Martyn Gaudion on his latest book, share some concerning tariff news, follow that up with some promising (and not-so-promising) investments, and feature a paper from last January’s inaugural Pan-European Design Conference.

Elephantech Launches World’s Smallest-Class Copper Nanofiller

07/17/2025 | Elephantech
Japanese deep-tech startup Elephantech has launched its cutting-edge 15 nm class copper nanofiller – the smallest class available globally. This breakthrough makes Elephantech one of the first companies in the world to provide such advanced material for commercial use.

Copper Price Surge Raises Alarms for Electronics

07/15/2025 | Global Electronics Association Advocacy and Government Relations Team
The copper market is experiencing major turbulence in the wake of U.S. President Donald Trump’s announcement of a 50% tariff on imported copper effective Aug. 1. Recent news reports, including from the New York Times, sent U.S. copper futures soaring to record highs, climbing nearly 13% in a single day as manufacturers braced for supply shocks and surging costs.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

07/11/2025 | Andy Shaughnessy, Design007 Magazine
This week, we have quite a variety of news items and articles for you. News continues to stream out of Washington, D.C., with tariffs rearing their controversial head again. Because these tariffs are targeted at overseas copper manufacturers, this news has a direct effect on our industry.I-Connect007 Editor’s Choice: Five Must-Reads for the Week

Digital Twin Concept in Copper Electroplating Process Performance

07/11/2025 | Aga Franczak, Robrecht Belis, Elsyca N.V.
PCB manufacturing involves transforming a design into a physical board while meeting specific requirements. Understanding these design specifications is crucial, as they directly impact the PCB's fabrication process, performance, and yield rate. One key design specification is copper thieving—the addition of “dummy” pads across the surface that are plated along with the features designed on the outer layers. The purpose of the process is to provide a uniform distribution of copper across the outer layers to make the plating current density and plating in the holes more uniform.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in