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Advanced Electronics Packaging Digest

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Suggested Items

Koh Young to Unveil AI Inspection Solutions at NEPCON Asia 2026

10/07/2026 | Koh Young Technology
Koh Young Technology, the industry leader in True 3D measurement-based inspection solutions, will unveil its latest inspection platforms and AI-powered process solutions at NEPCON Asia 2026, October 27–29 at the Shenzhen World Exhibition & Convention Center in Shenzhen.

Aismalibar to Showcase Advanced Thermal Management Materials at The Battery Show North America 2026

10/07/2026 | Aismalibar
Aismalibar, a global leader in advanced thermal management materials for electronics and high-power applications, will exhibit at The Battery Show North America 2026, taking place October 12–15 at Huntington Place in Detroit, Michigan.

Qnity Introduces High-Temperature Sealing Solution for Semiconductor Manufacturing

10/06/2026 | BUSINESS WIRE
Qnity Electronics, Inc., a premier technology solutions leader across the semiconductor value chain, introduced Kalrez® 7080 perfluoroelastomer parts, a high-performance sealing solution engineered for semiconductor processes operating at temperatures up to 330°C.

MKS' Atotech to Showcase Semiconductor Solutions at SEDEX 2026

10/05/2026 | MKS Inc.
MKS Inc. , a global provider of enabling technologies that transform our world, announced that its strategic brand Atotech, offering process chemicals, equipment, software, and services, will exhibit at SEDEX 2026, taking place October 14-16, 2026, in Seoul, South Korea.

Real Time with... THECA 2026: DTECH Advances PCB Drilling for AI and High-Speed Systems

09/25/2026 | Real Time with... THECA
Sheryl Zheng, marketing manager at DTECH, discusses how AI and high-speed communications are reshaping PCB drilling requirements. She explains DTECH's evolution from a PCB tool specialist into a broader solutions provider and why drill-bit performance is becoming a more critical element of producing advanced, high-quality circuit boards.
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