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Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
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From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
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From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
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Flexible Board Makers See Potential in Mini LED Backlighting
October 3, 2019 | DigitimesEstimated reading time: Less than a minute
With Apple reportedly looking to incorporate mini LED display technology into its iPad and MacBook product lines between the second half of 2020 and first half of 2021, Taiwan-based flexible PCB makers including Zhen Ding Technology and Flexium Interconnect stand a good chance of entering the supporting supply chain.
Flexium has long been in the supply chain of LED backlight modules for iPad and MacBook models, and will be in a better position to win orders should Apple adopt mini LED backlight modules for new iPads and MacBook.
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Brent Fischthal - Koh YoungSuggested Items
LPKF Strengthens LIDE Technology Leadership with New Patent Protection in Korea
09/04/2025 | LPKFLPKF Laser & Electronics SE today announced that its groundbreaking LIDE (Laser Induced Deep Etching) technology has received additional patent protection in Korea through the Korean Patent Office (KPCA), effective September 1, 2025.
UHDI Fundamentals: UHDI Technology and Industry 4.0
09/03/2025 | Anaya Vardya, American Standard CircuitsUltra high density interconnect (UHDI) technology is rapidly transforming how smart systems are designed and deployed in the context of Industry 4.0. With its capacity to support highly miniaturized, high-performance, and densely packed electronics, UHDI is a critical enabler of the smart, connected, and automated industrial future. Here, I’ll explore the synergy between UHDI and Industry 4.0 technologies, highlighting applications, benefits, and future directions.
CEE PCB Launches PCBpedia: A New Knowledge Hub for Circuit Board Technology
09/03/2025 | CEE PCBCEE PCB, a leading manufacturer of PCBs and FPCs, is responding to the growing demand for reliable technical knowledge. With PCBpedia, CEE introduces a new knowledge platform featuring expert articles on key topics in circuit board technology – from FPC design rules to surface finishes.
Coming Soon: The Advanced Electronics Packaging Digest
08/27/2025 | Marcy LaRont, I-Connect007The upcoming Advanced Electronics Packaging Digest is a curated, condensed monthly publication designed to keep you informed and engaged with the fast-moving world of advanced electronics packaging (AEP). In our inaugural September issue, we will begin at the foundation with an in-depth interview featuring Matt Kelly, CTO of the Global Electronics Association. Kelly and his Technology Solutions Team approach advanced packaging from a holistic systems perspective.
Nordson Reports Q3 Fiscal 2025 Results and Updates Full Year Guidance
08/21/2025 | BUSINESS WIRENordson Corporation reported results for the fiscal third quarter ended July 31, 2025. Sales were $742 million compared to the prior year’s third quarter sales of $662 million.