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The Legislative Outlook: Helping or Hurting?
This month, we examine the rules and laws shaping the current global business landscape and how these factors may open some doors but may also complicate business operations, making profitability more challenging.
Advancing the Advanced Materials Discussion
Moore’s Law is no more, and the advanced material solutions to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.
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Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
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Flexible Board Makers See Potential in Mini LED Backlighting
October 3, 2019 | DigitimesEstimated reading time: Less than a minute
With Apple reportedly looking to incorporate mini LED display technology into its iPad and MacBook product lines between the second half of 2020 and first half of 2021, Taiwan-based flexible PCB makers including Zhen Ding Technology and Flexium Interconnect stand a good chance of entering the supporting supply chain.
Flexium has long been in the supply chain of LED backlight modules for iPad and MacBook models, and will be in a better position to win orders should Apple adopt mini LED backlight modules for new iPads and MacBook.
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GlobalFoundries, Silicon Labs Expand Partnership to Accelerate Wireless Connectivity Solutions and Strengthen U.S. Chip Manufacturing
11/05/2025 | GlobalFoundriesGlobalFoundries (GF), one of the world’s leading semiconductor manufacturers, and Silicon Labs, the leading innovator in low-power wireless, announced the expansion of their strategic partnership to advance the development of next-generation, energy-efficient wireless technologies and scale U.S.-based semiconductor manufacturing.
Learning With Leo: UHDI—The Next Leap in PCB Manufacturing
11/05/2025 | Leo Lambert -- Column: Learning With LeoHigh density interconnect (HDI) technology has been a cornerstone of miniaturized electronics since Hewlett-Packard introduced the first chip-scale implementation in 1982. Over time, HDI processes became central to organic flip-chip packaging in the semiconductor industry. Today, the convergence of IC substrates and system-level PCBs has accelerated the adoption of UHDI.
On the Line With… Ultra HDI, Episode 8: “Materials, Up and Coming Capabilities,” Now Available
11/05/2025 | I-Connect007I-Connect007 is excited to announce the release of the eighth episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Materials, Up and Coming Capabilities,” host Nolan Johnson sits down with resident expert John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to discuss how material selection influences the Ultra HDI (UHDI) manufacturing process.
High Density Packaging User Group Announces ASKPCB Membership
11/03/2025 | HDP User GroupHigh Density Packaging User Group (HDP) is pleased to announce that the Aoshikang Technology (Hong Kong) Co., Ltd (ASKPCB) has become a member.
Cephia Secures $4M Seed Funding to Revolutionize Multimodal Sensing with Metasurface Technology
10/31/2025 | PRNewswireCephia, a startup building products using advanced AI computational imaging technologies and silicon sensors made from advanced metamaterials, formally launched with several pilot customers and $4 million in seed venture capital funding.